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There are 7810049 results for: content related to: Multichip Module Technology

  1. Silver-Palladium Thick-Film Conductors

    Journal of the American Ceramic Society

    Volume 77, Issue 12, December 1994, Pages: 3051–3072, Sea Fue Wang, Joseph P. Dougherty, Wayne Huebner and John G. Pepin

    Version of Record online : 8 MAR 2005, DOI: 10.1111/j.1151-2916.1994.tb04549.x

  2. Multichip Module and Microwave Hybrid Circuits

    Handbook of Thick- and Thin-Film Hybrid Microelectronics

    Tapan K. Gupta, Pages: 331–384, 2005

    Published Online : 28 JAN 2005, DOI: 10.1002/0471723673.ch11

  3. Integrated Circuit Packaging

    Handbook of Semiconductor Technology Set

    Kenneth A. Jackson, Wolfgang Schröter, Pages: 607–647, 2008

    Published Online : 4 JUN 2008, DOI: 10.1002/9783527619290.ch11a

  4. Integrated Circuit Packaging

    Handbook of Semiconductor Technology: Processing of Semiconductors, Volume 2

    Kenneth A. Jackson, Wolfgang Schröter, Pages: 607–647, 2008

    Published Online : 28 MAY 2008, DOI: 10.1002/9783527621828.ch11

  5. Integrated Circuit Packaging

    Standard Article

    Materials Science and Technology

    Daniel I. Amey

    Published Online : 15 FEB 2013, DOI: 10.1002/9783527603978.mst0265

  6. Low-Temperature Co-Fired Ceramic Chip Carriers

    Handbook of Advanced Materials: Enabling New Designs

    John U. Knickerbocker, Sarah H. Knickerbocker, Pages: 129–148, 2004

    Published Online : 8 JUN 2004, DOI: 10.1002/0471465186.ch4

  7. Introduction

    Handbook of Thick- and Thin-Film Hybrid Microelectronics

    Tapan K. Gupta, Pages: 1–39, 2005

    Published Online : 28 JAN 2005, DOI: 10.1002/0471723673.ch1

  8. Wideband, multichannel transmit module based on wireless MMIC chip set

    Microwave and Optical Technology Letters

    Volume 18, Issue 6, 20 August 1998, Pages: 377–382, Scott A. Wartenberg, Ty L. Barkdoll, Robert W. Mumper and Gary E. Zuzak

    Version of Record online : 7 DEC 1998, DOI: 10.1002/(SICI)1098-2760(19980820)18:6<377::AID-MOP4>3.0.CO;2-A

  9. High-value transitional care: translation of research into practice

    Journal of Evaluation in Clinical Practice

    Volume 19, Issue 5, October 2013, Pages: 727–733, Mary D. Naylor, Kathryn H. Bowles, Kathleen M. McCauley, Maureen C. Maccoy, Greg Maislin, Mark V. Pauly and Randall Krakauer

    Version of Record online : 16 MAR 2011, DOI: 10.1111/j.1365-2753.2011.01659.x

  10. Application of the thermal network method to the transient thermal analysis of multichip modules

    Heat Transfer - Japanese Research

    Volume 26, Issue 8, 1997, Pages: 541–553, Masaru Ishizuka

    Version of Record online : 6 DEC 1998, DOI: 10.1002/(SICI)1520-6556(1997)26:8<541::AID-HTJ4>3.0.CO;2-W

  11. You have free access to this content
    Frontmatter

    Cofire Technology: Ceramic Engineering and Science Proceedings, Volume 9, Issue 11/12

    John B. Wachtman, Pages: i–v, 2008

    Published Online : 26 MAR 2008, DOI: 10.1002/9780470310519.fmatter

  12. You have free access to this content
    Valuing Australian botanic collections: a combined travel-cost and contingent valuation study

    Australian Journal of Agricultural and Resource Economics

    Volume 56, Issue 4, October 2012, Pages: 498–520, Paul Mwebaze and Jeff Bennett

    Version of Record online : 1 MAY 2012, DOI: 10.1111/j.1467-8489.2012.00595.x

  13. You have free access to this content
    A new approach to analysis of the impulse response function (IRF) in dynamic contrast-enhanced MRI (DCEMRI): A simulation study

    Magnetic Resonance in Medicine

    Volume 62, Issue 1, July 2009, Pages: 229–239, Xiaobing Fan and Gregory S. Karczmar

    Version of Record online : 15 MAY 2009, DOI: 10.1002/mrm.21995

  14. Translating research into practice: transitional care for older adults

    Journal of Evaluation in Clinical Practice

    Volume 15, Issue 6, December 2009, Pages: 1164–1170, Mary D. Naylor, Penny Hollander Feldman, Stacen Keating, Mary Jane Koren, Ellen T. Kurtzman, Maureen C. Maccoy and Randall Krakauer

    Version of Record online : 23 DEC 2009, DOI: 10.1111/j.1365-2753.2009.01308.x

  15. Pre-imidized photoimageable polyimide as a dielectric for high density multichip modules

    Polymer Engineering & Science

    Volume 32, Issue 21, November 1992, Pages: 1646–1652, Jay M. Cech, Andrew F. Burnett and Lisa Knapp

    Version of Record online : 26 AUG 2004, DOI: 10.1002/pen.760322119

  16. Microwave power distribution in a multichip module radiative interconnection system

    Microwave and Optical Technology Letters

    Volume 18, Issue 3, 20 June 1998, Pages: 196–200, R. D. Seager

    Version of Record online : 7 DEC 1998, DOI: 10.1002/(SICI)1098-2760(19980620)18:3<196::AID-MOP10>3.0.CO;2-2

  17. Coded Modulation Theory and Performance

    Turbo Coding, Turbo Equalisation and Space-Time Coding: EXIT-Chart-Aided Near-Capacity Designs for Wireless Channels, Second Edition

    L. Hanzo, T. H. Liew, B. L. Yeap, R. Y. S. Tee, S. X. Ng, Pages: 385–463, 2011

    Published Online : 22 MAR 2011, DOI: 10.1002/9780470978481.ch14

  18. Packaging and Thermal Considerations

    Handbook of Thick- and Thin-Film Hybrid Microelectronics

    Tapan K. Gupta, Pages: 300–330, 2005

    Published Online : 28 JAN 2005, DOI: 10.1002/0471723673.ch10

  19. Effect of bioactive ceramic dissolution on the mechanism of bone mineralization and guided tissue growth in vitro

    Journal of Biomedical Materials Research Part A

    Volume 76A, Issue 2, February 2006, Pages: 386–397, A. El-Ghannam and C. Q. Ning

    Version of Record online : 3 NOV 2005, DOI: 10.1002/jbm.a.30517

  20. Neural network approach for comodeling design of multichip module

    Microwave and Optical Technology Letters

    Volume 50, Issue 7, July 2008, Pages: 1770–1775, M. El Zoghbi, D. Baillargeat, S. Bila, S. Verdeyme and J. F. Villemazet

    Version of Record online : 23 APR 2008, DOI: 10.1002/mop.23530