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There are 14488 results for: content related to: Morphological Development of Zirconia-Metal Interface

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    The penC mutation conferring antibiotic resistance in Neisseria gonorrhoeae arises from a mutation in the PilQ secretin that interferes with multimer stability

    Molecular Microbiology

    Volume 57, Issue 5, September 2005, Pages: 1238–1251, Shuqing Zhao, Deborah M. Tobiason, Mei Hu, H. Steven Seifert and Robert A. Nicholas

    Article first published online : 25 JUL 2005, DOI: 10.1111/j.1365-2958.2005.04752.x

  2. Geodynamic evolution and thermal history of the central Flin Flon Domain, Trans-Hudson Orogen: Constraints from structural development, 40Ar/39Ar, and stable isotope geothermometry

    Tectonics

    Volume 14, Issue 2, April 1995, Pages: 472–503, J. S. Fedorowich, R. Kerrich, M. R. Stauffer

    Article first published online : 26 JUL 2010, DOI: 10.1029/94TC01318

  3. Consolidation and self-bonding in poly(ether ether ketone) (PEEK)

    Journal of Applied Polymer Science

    Volume 56, Issue 11, 13 June 1995, Pages: 1435–1454, Bum-Rae Cho and John L. Kardos

    Article first published online : 10 MAR 2003, DOI: 10.1002/app.1995.070561106

  4. Thermal bonding of polypropylene nonwovens: Effect of bonding variables on the structure and properties of the fabrics

    Journal of Applied Polymer Science

    Volume 92, Issue 6, 15 June 2004, Pages: 3593–3600, Gajanan S. Bhat, Praveen K. Jangala and Joseph E. Spruiell

    Article first published online : 26 MAR 2004, DOI: 10.1002/app.20411

  5. Proceedings of the 13th International Conference on Metal Forming

    steel research international

    Volume 81, Issue 9, September 2010,

    Article first published online : 27 JAN 2011, DOI: 10.1002/srin.201190002

  6. Thermal bonding of polypropylene films and fibers

    Journal of Applied Polymer Science

    Volume 110, Issue 5, 5 December 2008, Pages: 3047–3058, Raghavendra R. Hegde, Gajanan S. Bhat and R. A. Campbell

    Article first published online : 8 SEP 2008, DOI: 10.1002/app.28901

  7. Structure–property relationships of thermally bonded polypropylene nonwovens

    Journal of Applied Polymer Science

    Volume 30, Issue 4, April 1985, Pages: 1523–1534, K. Y. Wei, T. L. Vigo and B. C. Goswami

    Article first published online : 9 MAR 2003, DOI: 10.1002/app.1985.070300417

  8. Asset Pricing with Conditioning Information: A New Test

    The Journal of Finance

    Volume 58, Issue 1, February 2003, Pages: 161–196, Kevin Q. Wang

    Article first published online : 12 FEB 2003, DOI: 10.1111/1540-6261.00521

  9. Numerical Modeling of Solid State Bonding Based on Fundamental Bonding Mechanisms: For Bonding between Dissimilar Materials

    Advances in Joining of Ceramics, Volume 138

    Charles A. Lewinsohn, Mrityunjay Singh, Ronald Loehman, Pages: 29–47, 2012

    Published Online : 20 APR 2012, DOI: 10.1002/9781118405802.ch2

  10. Hot-melt adhesion and wettability between polyethylene and other polymers in the vicinity of the adherend melting point

    Journal of Applied Polymer Science

    Volume 34, Issue 7, 20 November 1987, Pages: 2485–2491, Masaki Imachi

    Article first published online : 9 MAR 2003, DOI: 10.1002/app.1987.070340712

  11. Morphology and Structure of Constituent Fibres in Thermally Bonded Nonwovens

    Macromolecular Materials and Engineering

    Volume 291, Issue 5, May 23, 2006, Pages: 499–509, Xiao Yan Wang and Rong Hua Gong

    Article first published online : 2 MAY 2006, DOI: 10.1002/mame.200500385

  12. Adhesion between dissimilar polymers. II. Effects of bonding temperature and crosslinking agent

    Journal of Applied Polymer Science

    Volume 93, Issue 1, 5 July 2004, Pages: 323–335, M. F. Tse, W. Hu, M. S. Yeganeh and D. Zhang

    Article first published online : 13 APR 2004, DOI: 10.1002/app.20438

  13. Active Metal Brazing of Si3N4 to Metals

    22nd Annual Conference on Composites, Advanced Ceramics, Materials, and Structures: B: Ceramic Engineering and Science Proceedings, Volume 19, Issue 4

    Maiken Heim, Luiz A. B. Tessarotto, Victor A. Greenhut, Pages: 347–354, 2010

    Published Online : 23 MAR 2010, DOI: 10.1002/9780470294499.ch40

  14. Optimizing Diffusion Bonding Parameters to Maximize the Strength of AA6061 Aluminum and AZ61A Magnesium Alloy Joints

    Experimental Techniques

    Volume 38, Issue 4, July/August 2014, Pages: 21–36, M. Joseph Fernandus, T. Senthilkumar, V. Balasubramanian and S. Rajakumar

    Article first published online : 22 MAY 2012, DOI: 10.1111/j.1747-1567.2012.00815.x

  15. Relationships Between Birefringence of Constituent Fibers and Properties of Thermally Bonded Nonwovens

    Macromolecular Materials and Engineering

    Volume 291, Issue 7, July 14, 2006, Pages: 802–808, Xiao Yan Wang and Rong Hua Gong

    Article first published online : 3 JUL 2006, DOI: 10.1002/mame.200600069

  16. Effect of bonding temperature on the interfacial bonding strength of polyethylene/polypropylene and other polymers

    Journal of Polymer Science Part C: Polymer Letters

    Volume 24, Issue 10, October 1986, Pages: 537–540, M. Imachi

    Article first published online : 11 MAR 2003, DOI: 10.1002/pol.1986.140241008

  17. Thermally bonded nonwoven filters composed of bicomponent polypropylene/polyester fiber. I. Statistical approach for minimizing the pore size

    Journal of Applied Polymer Science

    Volume 101, Issue 4, 15 August 2006, Pages: 2689–2699, X. Y. Wang and R. H. Gong

    Article first published online : 27 MAY 2006, DOI: 10.1002/app.23915

  18. Review of thermally point-bonded nonwovens: Materials, processes, and properties

    Journal of Applied Polymer Science

    Volume 99, Issue 5, 5 March 2006, Pages: 2489–2496, Stephen Michielsen, Behnam Pourdeyhimi and Prashant Desai

    Article first published online : 16 DEC 2005, DOI: 10.1002/app.22858

  19. Joining of Ceramics

    Standard Article

    Materials Science and Technology

    Michael G. Nicholas

    Published Online : 15 SEP 2006, DOI: 10.1002/9783527603978.mst0204

  20. Wafer-Level Solid–Liquid Interdiffusion Bonding

    Handbook of Wafer Bonding

    Nils Hoivik, Knut Aasmundtveit, Pages: 181–214, 2012

    Published Online : 8 FEB 2012, DOI: 10.1002/9783527644223.ch10