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There are 16272 results for: content related to: Plasma Processing of Low- k Dielectrics

  1. Electrical Breakdown in Advanced Interconnect Dielectrics

    Advanced Interconnects for ULSI Technology

    Ennis T. Ogawa, Oliver Aubel, Pages: 369–434, 2012

    Published Online : 17 FEB 2012, DOI: 10.1002/9781119963677.ch11

  2. Ultra-Low-k by CVD: Deposition and Curing

    Advanced Interconnects for ULSI Technology

    Vincent Jousseaume, Aziz Zenasni, Olivier Gourhant, Laurent Favennec, Mikhail R. Baklanov, Pages: 35–77, 2012

    Published Online : 17 FEB 2012, DOI: 10.1002/9781119963677.ch2

  3. Wet Clean Applications in Porous Low-k Patterning Processes

    Advanced Interconnects for ULSI Technology

    Quoc Toan Le, Guy Vereecke, Herbert Struyf, Els Kesters, Mikhail R. Baklanov, Pages: 129–171, 2012

    Published Online : 17 FEB 2012, DOI: 10.1002/9781119963677.ch4

  4. Mechanical Reliability of Low-k Dielectrics

    Advanced Interconnects for ULSI Technology

    Kris Vanstreels, Han Li, Joost J. Vlassak, Pages: 339–367, 2012

    Published Online : 17 FEB 2012, DOI: 10.1002/9781119963677.ch10

  5. Low-k Materials: Recent Advances

    Advanced Interconnects for ULSI Technology

    Geraud Dubois, Willi Volksen, Pages: 1–33, 2012

    Published Online : 17 FEB 2012, DOI: 10.1002/9781119963677.ch1

  6. Process Integration of Interconnects

    Advanced Interconnects for ULSI Technology

    Sridhar Balakrishnan, Ruth Brain, Larry Zhao, Pages: 235–265, 2012

    Published Online : 17 FEB 2012, DOI: 10.1002/9781119963677.ch7

  7. Nondestructive Evaluation of Critical Properties of Thin Porous Films

    Porous Polymers

    Mikhail R. Baklanov, Denis Shamiryan, Pages: 205–245, 2011

    Published Online : 25 JAN 2011, DOI: 10.1002/9780470929445.ch6

  8. Integration of Low-k Dielectric Films in Damascene Processes

    Dielectric Films for Advanced Microelectronics

    R.J.O.M. Hoofman, V.H. Nguyen, V. Arnal, M. Broekaart, L.G. Gosset, W.F.A. Besling, M. Fayolle, F. Iacopi, Pages: 199–250, 2007

    Published Online : 19 MAR 2007, DOI: 10.1002/9780470017944.ch5

  9. Chemistry in Interconnects

    Chemistry in Microelectronics

    Vincent Jousseaume, Paul-Henri Haumesser, Carole Pernel, Jeffery Butterbaugh, Sylvain Maîtrejean, Didier Louis, Pages: 81–186, 2013

    Published Online : 14 MAR 2013, DOI: 10.1002/9781118578070.ch2

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    Front Matter

    Advanced Interconnects for ULSI Technology

    Mikhail R. Baklanov, Paul S. Ho, Ehrenfried Zschech, Pages: i–xxvi, 2012

    Published Online : 17 FEB 2012, DOI: 10.1002/9781119963677.fmatter

  11. 3D Interconnect Technology

    Advanced Interconnects for ULSI Technology

    John U. Knickerbocker, Lay Wai Kong, Sven Niese, Alain Diebold, Ehrenfried Zschech, Pages: 435–490, 2012

    Published Online : 17 FEB 2012, DOI: 10.1002/9781119963677.ch12

  12. Scaling and Microstructure Effects on Electromigration Reliability for Cu Interconnects

    Advanced Interconnects for ULSI Technology

    Chao-Kun Hu, René Hübner, Lijuan Zhang, Meike Hauschildt, Paul S. Ho, Pages: 291–337, 2012

    Published Online : 17 FEB 2012, DOI: 10.1002/9781119963677.ch9

  13. Optical Interconnects

    Advanced Interconnects for ULSI Technology

    Mikhail R. Baklanov, Paul S. Ho, Ehrenfried Zschech, Pages: 503–542, 2012

    Published Online : 17 FEB 2012, DOI: 10.1002/9781119963677.ch14

  14. Post Porosity Plasma Protection: Scaling of Efficiency with Porosity

    Advanced Functional Materials

    Volume 22, Issue 14, July 24, 2012, Pages: 3043–3050, Theo Frot, Willi Volksen, Sampath Purushothaman, Robert L. Bruce, Teddie Magbitang, Dolores C. Miller, Vaughn R. Deline and Geraud Dubois

    Version of Record online : 17 APR 2012, DOI: 10.1002/adfm.201200152

  15. Carbon Nanotubes for Interconnects

    Advanced Interconnects for ULSI Technology

    Mizuhisa Nihei, Motonobu Sato, Akio Kawabata, Shintaro Sato, Yuji Awano, Pages: 491–502, 2012

    Published Online : 17 FEB 2012, DOI: 10.1002/9781119963677.ch13

  16. Material Engineering of High-k Gate Dielectrics

    Dielectric Films for Advanced Microelectronics

    Akira Toriumi, Koji Kita, Pages: 297–336, 2007

    Published Online : 19 MAR 2007, DOI: 10.1002/9780470017944.ch7

  17. Ellipsometric Porosimetry and Electrochemical Impedance Spectroscopy Characterization for Moisture Permeation Barrier Layers

    Plasma Processes and Polymers

    Volume 12, Issue 9, September 2015, Pages: 968–979, Alberto Perrotta, Santiago J. García and Mariadriana Creatore

    Version of Record online : 16 JUL 2015, DOI: 10.1002/ppap.201500084

  18. You have free access to this content
    Front Matter

    Dielectric Films for Advanced Microelectronics

    Mikhail R. Baklanov, Martin L. Green, Karen Maex, Pages: i–xxii, 2007

    Published Online : 19 MAR 2007, DOI: 10.1002/9780470017944.fmatter

  19. Spin-on Dielectric Materials

    Dielectric Films for Advanced Microelectronics

    Geraud Dubois, Robert D. Miller, Willi Volksen, Pages: 33–83, 2007

    Published Online : 19 MAR 2007, DOI: 10.1002/9780470017944.ch2

  20. Copper Electroplating for On-Chip Metallization

    Advanced Interconnects for ULSI Technology

    Mikhail R. Baklanov, Paul S. Ho, Ehrenfried Zschech, Pages: 173–191, 2012

    Published Online : 17 FEB 2012, DOI: 10.1002/9781119963677.ch5