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There are 5580 results for: content related to: Process Integration of Interconnects

  1. Electrical Breakdown in Advanced Interconnect Dielectrics

    Advanced Interconnects for ULSI Technology

    Ennis T. Ogawa, Oliver Aubel, Pages: 369–434, 2012

    Published Online : 17 FEB 2012, DOI: 10.1002/9781119963677.ch11

  2. Low-k Materials: Recent Advances

    Advanced Interconnects for ULSI Technology

    Geraud Dubois, Willi Volksen, Pages: 1–33, 2012

    Published Online : 17 FEB 2012, DOI: 10.1002/9781119963677.ch1

  3. Ultra-Low-k by CVD: Deposition and Curing

    Advanced Interconnects for ULSI Technology

    Vincent Jousseaume, Aziz Zenasni, Olivier Gourhant, Laurent Favennec, Mikhail R. Baklanov, Pages: 35–77, 2012

    Published Online : 17 FEB 2012, DOI: 10.1002/9781119963677.ch2

  4. 3D Interconnect Technology

    Advanced Interconnects for ULSI Technology

    John U. Knickerbocker, Lay Wai Kong, Sven Niese, Alain Diebold, Ehrenfried Zschech, Pages: 435–490, 2012

    Published Online : 17 FEB 2012, DOI: 10.1002/9781119963677.ch12

  5. Scaling and Microstructure Effects on Electromigration Reliability for Cu Interconnects

    Advanced Interconnects for ULSI Technology

    Chao-Kun Hu, René Hübner, Lijuan Zhang, Meike Hauschildt, Paul S. Ho, Pages: 291–337, 2012

    Published Online : 17 FEB 2012, DOI: 10.1002/9781119963677.ch9

  6. Plasma Processing of Low-k Dielectrics

    Advanced Interconnects for ULSI Technology

    Hualiang Shi, Denis Shamiryan, Jean-François de Marneffe, Huai Huang, Paul S. Ho, Mikhail R. Baklanov, Pages: 79–128, 2012

    Published Online : 17 FEB 2012, DOI: 10.1002/9781119963677.ch3

  7. Chemistry in Interconnects

    Chemistry in Microelectronics

    Vincent Jousseaume, Paul-Henri Haumesser, Carole Pernel, Jeffery Butterbaugh, Sylvain Maîtrejean, Didier Louis, Pages: 81–186, 2013

    Published Online : 14 MAR 2013, DOI: 10.1002/9781118578070.ch2

  8. Diffusion Barriers

    Advanced Interconnects for ULSI Technology

    Michael Hecker, René Hübner, Pages: 193–234, 2012

    Published Online : 17 FEB 2012, DOI: 10.1002/9781119963677.ch6

  9. Low-κ/Cu Cleaning and Drying

    Handbook of Cleaning in Semiconductor Manufacturing: Fundamental and Applications

    Karen A. Reinhardt, Richard F. Reidy, Jerome Daviot, Pages: 355–394, 2011

    Published Online : 22 FEB 2011, DOI: 10.1002/9781118071748.ch10

  10. Copper Electroplating for On-Chip Metallization

    Advanced Interconnects for ULSI Technology

    Mikhail R. Baklanov, Paul S. Ho, Ehrenfried Zschech, Pages: 173–191, 2012

    Published Online : 17 FEB 2012, DOI: 10.1002/9781119963677.ch5

  11. Wet Clean Applications in Porous Low-k Patterning Processes

    Advanced Interconnects for ULSI Technology

    Quoc Toan Le, Guy Vereecke, Herbert Struyf, Els Kesters, Mikhail R. Baklanov, Pages: 129–171, 2012

    Published Online : 17 FEB 2012, DOI: 10.1002/9781119963677.ch4

  12. Optical Interconnects

    Advanced Interconnects for ULSI Technology

    Mikhail R. Baklanov, Paul S. Ho, Ehrenfried Zschech, Pages: 503–542, 2012

    Published Online : 17 FEB 2012, DOI: 10.1002/9781119963677.ch14

  13. Carbon Nanotubes for Interconnects

    Advanced Interconnects for ULSI Technology

    Mizuhisa Nihei, Motonobu Sato, Akio Kawabata, Shintaro Sato, Yuji Awano, Pages: 491–502, 2012

    Published Online : 17 FEB 2012, DOI: 10.1002/9781119963677.ch13

  14. Temperature dependant crosstalk analysis in coupled single-walled carbon nanotube (SWCNT) bundle interconnects

    International Journal of Circuit Theory and Applications

    Mayank Kumar Rai and Sankar Sarkar

    Article first published online : 6 AUG 2014, DOI: 10.1002/cta.2013

  15. Development of a Low-Dielectric-Constant Polymer for the Fabrication of Integrated Circuit Interconnect

    Advanced Materials

    Volume 12, Issue 23, December, 2000, Pages: 1769–1778, S. J. Martin, J. P. Godschalx, M. E. Mills, E. O. Shaffer II and P. H. Townsend

    Article first published online : 14 DEC 2000, DOI: 10.1002/1521-4095(200012)12:23<1769::AID-ADMA1769>3.0.CO;2-5

  16. Hybrid Metal/Polymer Wafer Bonding Platform

    Handbook of Wafer Bonding

    Jian-Qiang Lu, J. Jay McMahon, Ronald J. Gutmann, Pages: 215–236, 2012

    Published Online : 8 FEB 2012, DOI: 10.1002/9783527644223.ch11

  17. Rensselaer 3D Integration Processes

    Handbook of 3D Integration: Technology and Applications of 3D Integrated Circuits

    James Jian-Qiang. Lu, Tim S. Cale, Ronald J. Gutmann, Pages: 447–462, 2008

    Published Online : 25 NOV 2008, DOI: 10.1002/9783527623051.ch23

  18. Nanoelectromagnetics: Circuit and Electromagnetic Properties of Carbon Nanotubes

    Small

    Volume 5, Issue 8, April 20, 2009, Pages: 884–906, Chris Rutherglen and Peter Burke

    Article first published online : 8 APR 2009, DOI: 10.1002/smll.200800527

  19. Wireless Interchip Interconnects

    Advanced Interconnects for ULSI Technology

    Mikhail R. Baklanov, Paul S. Ho, Ehrenfried Zschech, Pages: 543–563, 2012

    Published Online : 17 FEB 2012, DOI: 10.1002/9781119963677.ch15

  20. Metallic Interconnect Materials of Solid Oxide Fuel Cells

    Materials for High-Temperature Fuel Cells

    Li Jian, Hua Bin, Zhang Wenying, Pages: 159–213, 2013

    Published Online : 26 JUN 2013, DOI: 10.1002/9783527644261.ch5