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There are 10263 results for: content related to: Electromigration in Pb-Free Solder Joints in Electronic Packaging

  1. Electromigration Reliability of Pb-Free Solder Joints

    Lead-Free Solders: Materials Reliability for Electronics

    Seung-Hyun Chae, Yiwei Wang, Paul S. Ho, Pages: 337–373, 2012

    Published Online : 15 MAR 2012, DOI: 10.1002/9781119966203.ch14

  2. ‘Effects of Minor Alloying Additions on the Properties and Reliability of Pb-Free Solders and Joints’

    Lead-Free Solders: Materials Reliability for Electronics

    K. N. Subramanian, Pages: 119–159, 2012

    Published Online : 15 MAR 2012, DOI: 10.1002/9781119966203.ch5

  3. Effects of Electromigration on Electronic Solder Joints

    Lead-Free Solders: Materials Reliability for Electronics

    Sinn-Wen Chen, Chih-Ming Chen, Chao-Hong Wang, Chia-Ming Hsu, Pages: 401–422, 2012

    Published Online : 15 MAR 2012, DOI: 10.1002/9781119966203.ch16

  4. Accelerated Fatigue Life Assessment Approaches for Solders in Packages

    Modeling and Simulation for Microelectronic Packaging Assembly: Manufacturing, Reliability and Testing

    Sheng Liu, Yong Liu, Pages: 79–101, 2011

    Published Online : 2 SEP 2011, DOI: 10.1002/9780470827826.ch4

  5. Au/Sn Solder

    Handbook of Wafer Bonding

    Hermann Oppermann, Matthias Hutter, Pages: 119–138, 2012

    Published Online : 8 FEB 2012, DOI: 10.1002/9783527644223.ch7

  6. Constitutive and User-Supplied Subroutines for Solders Considering Damage Evolution

    Modeling and Simulation for Microelectronic Packaging Assembly: Manufacturing, Reliability and Testing

    Sheng Liu, Yong Liu, Pages: 45–78, 2011

    Published Online : 2 SEP 2011, DOI: 10.1002/9780470827826.ch3

  7. Material and Structural Testing for Small Samples

    Modeling and Simulation for Microelectronic Packaging Assembly: Manufacturing, Reliability and Testing

    Sheng Liu, Yong Liu, Pages: 21–44, 2011

    Published Online : 2 SEP 2011, DOI: 10.1002/9780470827826.ch2

  8. Data mining for improving the solder bumping process in the semiconductor packaging industry

    Intelligent Systems in Accounting, Finance and Management

    Volume 14, Issue 1-2, January - June 2006, Pages: 43–57, Chen-fu Chien, Huan-chung Li and Angus Jeang

    Version of Record online : 9 JAN 2007, DOI: 10.1002/isaf.273

  9. Influence of Miniaturization on Mechanical Reliability of Lead-Free Solder Interconnects

    Lead-Free Solders: Materials Reliability for Electronics

    Golta Khatibi, Herbert Ipser, Martin Lederer, Brigitte Weiss, Pages: 443–485, 2012

    Published Online : 15 MAR 2012, DOI: 10.1002/9781119966203.ch18

  10. Flip-Chip Underfills

    Standard Article

    Wiley Encyclopedia of Electrical and Electronics Engineering

    Daniel Lu, Yangyang Sun and C. P. Wong

    Published Online : 19 SEP 2013, DOI: 10.1002/047134608X.W8200

  11. Thermomigration in SnPb and Pb-Free Flip-Chip Solder Joints

    Lead-Free Solders: Materials Reliability for Electronics

    Tian Tian, K. N. Tu, Hsiao-Yun Chen, Hsiang-Yao Hsiao, Chih Chen, Pages: 423–442, 2012

    Published Online : 15 MAR 2012, DOI: 10.1002/9781119966203.ch17

  12. System in Package (SIP) Assembly

    Modeling and Simulation for Microelectronic Packaging Assembly: Manufacturing, Reliability and Testing

    Sheng Liu, Yong Liu, Pages: 361–394, 2011

    Published Online : 2 SEP 2011, DOI: 10.1002/9780470827826.ch12

  13. You have free access to this content
    HV-SoP Technology for Maskless Fine-Pitch Bumping Process

    ETRI Journal

    Volume 37, Issue 3, June 2015, Pages: 523–532, Jihye Son, Yong-Sung Eom, Kwang-Seong Choi, Haksun Lee, Hyun-Cheol Bae and Jin-Ho Lee

    Version of Record online : 1 JUN 2015, DOI: 10.4218/etrij.15.0114.0578

  14. Lead-Free Alloys for BGA/CSP Components

    Lead-Free Solder Process Development

    Gregory Henshall, Jasbir Bath, Carol A. Handwerker, Pages: 95–124, 2011

    Published Online : 25 FEB 2011, DOI: 10.1002/9780470901199.ch5

  15. You have free access to this content
    Advanced Packaging of Optoelectronic Devices

    Standard Article

    Wiley Encyclopedia of Electrical and Electronics Engineering

    Zirong Tang, Tielin Shi and Frank G. Shi

    Published Online : 18 JAN 2013, DOI: 10.1002/047134608X.W8193

  16. The Failure Mechanism of Recrystallization-Assisted Cracking of Solder Interconnections

    TMS2013 Supplemental Proceedings

    TMS, Pages: 401–411, 2013

    Published Online : 25 FEB 2013, DOI: 10.1002/9781118663547.ch50

  17. Isotropic Conductive Adhesive Interconnect Technology in Electronics Packaging Applications

    Adhesion in Microelectronics

    James E. Morris, Liang Wang, Pages: 173–210, 2014

    Published Online : 12 SEP 2014, DOI: 10.1002/9781118831373.ch5

  18. Environmentally Sound Assembly Processes

    Standard Article

    Wiley Encyclopedia of Electrical and Electronics Engineering

    Treliant Fang

    Published Online : 27 DEC 1999, DOI: 10.1002/047134608X.W2117

  19. Conductive Adhesives

    Standard Article

    Wiley Encyclopedia of Electrical and Electronics Engineering

    Daniel Lu, Yangyang Sun and C. P. Wong

    Published Online : 19 SEP 2013, DOI: 10.1002/047134608X.W8202

  20. Influence of Microstructure on Creep and High Strain Rate Fracture of Sn-Ag-Based Solder Joints

    Lead-Free Solders: Materials Reliability for Electronics

    P. Kumar, Z. Huang, I. Dutta, G. Subbarayan, R. Mahajan, Pages: 195–231, 2012

    Published Online : 15 MAR 2012, DOI: 10.1002/9781119966203.ch8