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There are 1693 results for: content related to: Electromigration in Pb-Free Solder Joints in Electronic Packaging

  1. Effects of Electromigration on Electronic Solder Joints

    Lead-Free Solders: Materials Reliability for Electronics

    Sinn-Wen Chen, Chih-Ming Chen, Chao-Hong Wang, Chia-Ming Hsu, Pages: 401–422, 2012

    Published Online : 15 MAR 2012, DOI: 10.1002/9781119966203.ch16

  2. Electromigration Reliability of Pb-Free Solder Joints

    Lead-Free Solders: Materials Reliability for Electronics

    Seung-Hyun Chae, Yiwei Wang, Paul S. Ho, Pages: 337–373, 2012

    Published Online : 15 MAR 2012, DOI: 10.1002/9781119966203.ch14

  3. The Changing Physics in Metal Interconnect Reliability

    Ceramic Integration and Joining Technologies: From Macro to Nanoscale

    Cher Ming Tan, Yuejin Hou, Pages: 415–447, 2011

    Published Online : 24 OCT 2011, DOI: 10.1002/9781118056776.ch14

  4. Scaling and Microstructure Effects on Electromigration Reliability for Cu Interconnects

    Advanced Interconnects for ULSI Technology

    Chao-Kun Hu, René Hübner, Lijuan Zhang, Meike Hauschildt, Paul S. Ho, Pages: 291–337, 2012

    Published Online : 17 FEB 2012, DOI: 10.1002/9781119963677.ch9

  5. Failure Analysis – What?

    Failure Analysis: A Practical Guide for Manufacturers of Electronic Components and Systems

    Marius Bâzu, Titu Băjenescu, Pages: 109–246, 2011

    Published Online : 26 APR 2011, DOI: 10.1002/9781119990093.ch5

  6. Electromigration

    Standard Article

    Wiley Encyclopedia of Electrical and Electronics Engineering

    Gary H. Bernstein and Alfred M. Kriman

    Published Online : 27 DEC 1999, DOI: 10.1002/047134608X.W3124

  7. Electromigration, models and atomistic interpretation

    Quality and Reliability Engineering International

    Volume 9, Issue 4, July/August 1993, Pages: 287–293, Reiner Kirchheim

    Article first published online : 20 MAR 2007, DOI: 10.1002/qre.4680090408

  8. Electromigration

    Modeling and Simulation for Microelectronic Packaging Assembly: Manufacturing, Reliability and Testing

    Sheng Liu, Yong Liu, Pages: 473–497, 2011

    Published Online : 2 SEP 2011, DOI: 10.1002/9780470827826.ch17

  9. Shape changes of voids in bamboo lines: A new electromigration failure mechanism

    Quality and Reliability Engineering International

    Volume 11, Issue 4, 1995, Pages: 279–283, O. Kraft, U. E. Möckl and E. Arzt

    Article first published online : 20 MAR 2007, DOI: 10.1002/qre.4680110412

  10. ‘Effects of Minor Alloying Additions on the Properties and Reliability of Pb-Free Solders and Joints’

    Lead-Free Solders: Materials Reliability for Electronics

    K. N. Subramanian, Pages: 119–159, 2012

    Published Online : 15 MAR 2012, DOI: 10.1002/9781119966203.ch5

  11. An extension of the rapid wafer-level wijet method and its comparison with conventional electromigration testing

    Quality and Reliability Engineering International

    Volume 8, Issue 3, 1992, Pages: 247–251, F. Jeuland, Ph. Normandon, G. Lormand and A. Boudou

    Article first published online : 3 JAN 2007, DOI: 10.1002/qre.4680080313

  12. Electromigration

    Reliability Wearout Mechanisms in Advanced CMOS Technologies

    Alvin W. Strong, Ernest Y. Wu, Rolf-Peter Vollertsen, Jordi Suñé, Giuseppe La Rosa, Stewart E. Rauch, Timothy D. Sullivan, Pages: 565–618, 2009

    Published Online : 14 OCT 2009, DOI: 10.1002/9780470455265.ch7

  13. The effect of barrier layers on the distribution function of interconnect electromigration failures

    Quality and Reliability Engineering International

    Volume 7, Issue 4, July/August 1991, Pages: 287–291, Mario Pinto

    Article first published online : 22 MAR 2007, DOI: 10.1002/qre.4680070415

  14. On the Astm electromigration test structure applied to Al–1%Si/TiN/Ti bamboo metal lines

    Quality and Reliability Engineering International

    Volume 11, Issue 1, 1995, Pages: 33–39, Ilaria de Munari, Massimo Vanzi, Andrea Scorzoni and Fausto Fantini

    Article first published online : 20 MAR 2007, DOI: 10.1002/qre.4680110106

  15. Study of the influence of thermal effects on the electromigration tests

    Quality and Reliability Engineering International

    Volume 11, Issue 1, 1995, Pages: 27–31, Saǎd Abdeslam and Gérard Lormand

    Article first published online : 20 MAR 2007, DOI: 10.1002/qre.4680110105

  16. Electrical Breakdown in Advanced Interconnect Dielectrics

    Advanced Interconnects for ULSI Technology

    Ennis T. Ogawa, Oliver Aubel, Pages: 369–434, 2012

    Published Online : 17 FEB 2012, DOI: 10.1002/9781119963677.ch11

  17. Fabrication of Cu Nanowires at Predetermined Positions by Utilising Stress Migration

    Strain

    Volume 44, Issue 2, April 2008, Pages: 201–208, N. Settsu, M. Saka and F. Yamaya

    Article first published online : 14 JAN 2008, DOI: 10.1111/j.1475-1305.2007.00370.x

  18. Yield and Reliability

    Introduction to Microfabrication, Second Edition

    Sami Franssila, Pages: 449–456, 2010

    Published Online : 9 NOV 2010, DOI: 10.1002/9781119990413.ch36

  19. Latest improvements in CIEF: From proteins to microorganisms

    PROTEOMICS

    Volume 12, Issue 19-20, October 2012, Pages: 2927–2936, Jiří Šalplachta, Anna Kubesová and Marie Horká

    Article first published online : 20 SEP 2012, DOI: 10.1002/pmic.201200136

  20. Chemistry in Interconnects

    Chemistry in Microelectronics

    Vincent Jousseaume, Paul-Henri Haumesser, Carole Pernel, Jeffery Butterbaugh, Sylvain Maîtrejean, Didier Louis, Pages: 81–186, 2013

    Published Online : 14 MAR 2013, DOI: 10.1002/9781118578070.ch2