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There are 16741 results for: content related to: The Use of Mental Models in Chemical Risk Protection: Developing a Generic Workplace Methodology

  1. Evaluating the Efficacy of a Mental Models Approach for Improving Occupational Chemical Risk Protection

    Risk Analysis

    Volume 24, Issue 2, April 2004, Pages: 349–361, Jörg Niewöhner, Patrick Cox, Simon Gerrard and Nick Pidgeon

    Version of Record online : 13 APR 2004, DOI: 10.1111/j.0272-4332.2004.00437.x

  2. Packaging Reliability, Chip-Scale Semiconductor

    Standard Article

    Wiley Encyclopedia of Electrical and Electronics Engineering

    Pradeep Lall

    Published Online : 27 DEC 1999, DOI: 10.1002/047134608X.W2103

  3. Soldering in Prosthodontics—An Overview, Part I

    Journal of Prosthodontics

    Volume 20, Issue 3, April 2011, Pages: 233–243, Gerard Byrne

    Version of Record online : 15 FEB 2011, DOI: 10.1111/j.1532-849X.2011.00691.x

  4. Biodegradable polymer scaffold, semi-solid solder, and single-spot lasing for increasing solder-tissue bonding in suture-free laser-assisted vascular repair

    Journal of Tissue Engineering and Regenerative Medicine

    Volume 6, Issue 10, November 2012, Pages: 803–812, Dara R. Pabittei, Michal Heger, Marc Simonet, Sjoerd van Tuijl, Allard C. van der Wal, Johan F. Beek, Ron Balm and Bas A. de Mol

    Version of Record online : 25 NOV 2011, DOI: 10.1002/term.486

  5. Experimental and numerical studies on size and constraining effects in lead-free solder joints

    Fatigue & Fracture of Engineering Materials & Structures

    Volume 30, Issue 5, May 2007, Pages: 387–399, J. CUGNONI, J. BOTSIS, V. SIVASUBRAMANIAM and J. JANCZAK-RUSCH

    Version of Record online : 21 NOV 2006, DOI: 10.1111/j.1460-2695.2006.01077.x

  6. Soldering and Brazing

    Standard Article

    Ullmann's Encyclopedia of Industrial Chemistry

    Daniel Schnee and Harald Krappitz

    Published Online : 15 JAN 2013, DOI: 10.1002/14356007.a24_427.pub2

  7. Optimal design of fatigue life for RCP with PoP package by using the Taguchi method

    International Journal of Numerical Modelling: Electronic Networks, Devices and Fields

    Volume 30, Issue 3-4, May-August 2017, Hsin-En Cheng and Rong-Sheng Chen

    Version of Record online : 5 DEC 2014, DOI: 10.1002/jnm.2036

  8. Control of Stress Concentration in Surface-Mounted Multilayer Ceramic Capacitor Subjected to Bending

    Journal of the American Ceramic Society

    Volume 97, Issue 4, April 2014, Pages: 1170–1176, Kun-Yen Chen, Chang-Wei Huang, Marklaw Wu, Wen-Cheng J. Wei and Chun-Hway Hsueh

    Version of Record online : 3 JAN 2014, DOI: 10.1111/jace.12781

  9. Defects in electronics and their significance for structural integrity

    Fatigue & Fracture of Engineering Materials & Structures

    Volume 30, Issue 5, May 2007, Pages: 432–442, W. J. PLUMBRIDGE

    Version of Record online : 7 SEP 2006, DOI: 10.1111/j.1460-2695.2006.01060.x

  10. Integrated Circuit Packaging

    Standard Article

    Materials Science and Technology

    Daniel I. Amey

    Published Online : 15 FEB 2013, DOI: 10.1002/9783527603978.mst0265

  11. Surface Mount Technology

    Standard Article

    Encyclopedia of RF and Microwave Engineering

    Walter J. Trybula and Michael Trybula

    Published Online : 15 APR 2005, DOI: 10.1002/0471654507.eme437

  12. Structural integrity in electronics

    Fatigue & Fracture of Engineering Materials & Structures

    Volume 27, Issue 8, August 2004, Pages: 723–734, W. J. PLUMBRIDGE and Y. KARIYA

    Version of Record online : 30 JUN 2004, DOI: 10.1111/j.1460-2695.2004.00808.x

  13. Low-cycle fatigue properties of eutectic solders at high temperatures

    Fatigue & Fracture of Engineering Materials & Structures

    Volume 30, Issue 5, May 2007, Pages: 413–419, YOSHIHARU KARIYA and TADATOMO SUGA

    Version of Record online : 25 APR 2007, DOI: 10.1111/j.1460-2695.2006.01091.x

  14. Surface Mount Technology

    Standard Article

    Wiley Encyclopedia of Electrical and Electronics Engineering

    Walter J. Trybula and Michael E. Trybula

    Published Online : 27 DEC 1999, DOI: 10.1002/047134608X.W2116

  15. The effect of temperature on the formation behavior of reaction layer in Sn-3.0Ag-0.5Cu solder joint with the addition of porous Copper interlayer

    Materialwissenschaft und Werkstofftechnik

    Volume 48, Issue 3-4, April 2017, Pages: 283–289, J. Nashrah Hani, J. Mohd Fadzil, Y. Farazila, A. Tadashi, M. Yukio and A. S. Mohd Hamdi

    Version of Record online : 25 APR 2017, DOI: 10.1002/mawe.201600767

  16. Evidence of Soldering Technology on Pre-Columbian Gold Pendants from Western and North-Western Colombia

    Archaeometry

    A. Harrison and E. Howe

    Version of Record online : 10 JAN 2017, DOI: 10.1111/arcm.12286

  17. Dynamic response of electronic materials to impact loading: review

    ZAMM - Journal of Applied Mathematics and Mechanics / Zeitschrift für Angewandte Mathematik und Mechanik

    E. Suhir and R. Ghaffarian

    Version of Record online : 12 JAN 2017, DOI: 10.1002/zamm.201600064

  18. Scanning Electron Microscopy Observations of Failures of Implant Overdenture Bars: A Case Series Report

    Clinical Implant Dentistry and Related Research

    Volume 12, Issue 1, March 2010, Pages: 26–38, J. Neil Waddell, Alan GT Payne, Michael V. Swain and Jules A. Kieser

    Version of Record online : 17 OCT 2008, DOI: 10.1111/j.1708-8208.2008.00127.x

  19. Flip-Chip Underfills

    Standard Article

    Wiley Encyclopedia of Electrical and Electronics Engineering

    Daniel Lu, Yangyang Sun and C. P. Wong

    Published Online : 19 SEP 2013, DOI: 10.1002/047134608X.W8200

  20. Rheology Study of Wafer Level Underfill

    Macromolecular Materials and Engineering

    Volume 290, Issue 12, December 15, 2005, Pages: 1204–1212, Yangyang Sun, Zhuqing Zhang and Ching Ping Wong

    Version of Record online : 21 NOV 2005, DOI: 10.1002/mame.200500149