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There are 19527 results for: content related to: Control of Stress Concentration in Surface-Mounted Multilayer Ceramic Capacitor Subjected to Bending

  1. Finite Element Analysis and Design of Thermal–Mechanical Stresses in Multilayer Ceramic Capacitors

    International Journal of Applied Ceramic Technology

    Volume 12, Issue 2, March/April 2015, Pages: 451–460, Chang-Wei Huang, Ben-Ting Chen, Kun-Yen Chen, Chun-Hway Hsueh, Wen-Cheng Wei and Chen-Te Lee

    Version of Record online : 12 SEP 2013, DOI: 10.1111/ijac.12176

  2. Surface Mount Technology

    Standard Article

    Encyclopedia of RF and Microwave Engineering

    Walter J. Trybula and Michael Trybula

    Published Online : 15 APR 2005, DOI: 10.1002/0471654507.eme437

  3. Rare earth (RE: Nd, Dy, Ho, Y, Yb, and Sc) aluminosilicates for joining silicon carbide components

    International Journal of Applied Ceramic Technology

    Volume 14, Issue 4, July/August 2017, Pages: 675–691, Marion Herrmann, Sarfraz Ahmad, Wolfgang Lippmann, Hans-Jürgen Seifert and Antonio Hurtado

    Version of Record online : 2 MAY 2017, DOI: 10.1111/ijac.12692

  4. Thermo-Mechanical Stresses and Mechanical Reliability of Multilayer Ceramic Capacitors (MLCC)

    Journal of the American Ceramic Society

    Volume 90, Issue 7, July 2007, Pages: 2151–2158, Jin-Woo Park, Jeong-Hoon Chae, Il-Hyun Park, Hyuk-Joon Youn and Yang-Ho Moon

    Version of Record online : 6 JUN 2007, DOI: 10.1111/j.1551-2916.2007.01688.x

  5. Strengthening Mechanisms in MLCCs: Residual Stress Versus Crack Tip Shielding

    Journal of the American Ceramic Society

    Volume 97, Issue 1, January 2014, Pages: 283–289, Wade R. Lanning and Christopher L. Muhlstein

    Version of Record online : 10 DEC 2013, DOI: 10.1111/jace.12662

  6. Integrated Circuit Packaging

    Standard Article

    Materials Science and Technology

    Daniel I. Amey

    Published Online : 15 FEB 2013, DOI: 10.1002/9783527603978.mst0265

  7. Packaging Reliability, Chip-Scale Semiconductor

    Standard Article

    Wiley Encyclopedia of Electrical and Electronics Engineering

    Pradeep Lall

    Published Online : 27 DEC 1999, DOI: 10.1002/047134608X.W2103

  8. Surface Mount Technology

    Standard Article

    Wiley Encyclopedia of Electrical and Electronics Engineering

    Walter J. Trybula and Michael E. Trybula

    Published Online : 27 DEC 1999, DOI: 10.1002/047134608X.W2116

  9. Soldering in Prosthodontics—An Overview, Part I

    Journal of Prosthodontics

    Volume 20, Issue 3, April 2011, Pages: 233–243, Gerard Byrne

    Version of Record online : 15 FEB 2011, DOI: 10.1111/j.1532-849X.2011.00691.x

  10. Electronic Materials and Packaging

    Standard Article

    Mechanical Engineers' Handbook

    Warren C. Fackler

    Published Online : 20 FEB 2015, DOI: 10.1002/9781118985960.meh113

  11. Experimental and numerical studies on size and constraining effects in lead-free solder joints

    Fatigue & Fracture of Engineering Materials & Structures

    Volume 30, Issue 5, May 2007, Pages: 387–399, J. CUGNONI, J. BOTSIS, V. SIVASUBRAMANIAM and J. JANCZAK-RUSCH

    Version of Record online : 21 NOV 2006, DOI: 10.1111/j.1460-2695.2006.01077.x

  12. Soldering and Brazing

    Standard Article

    Ullmann's Encyclopedia of Industrial Chemistry

    Daniel Schnee and Harald Krappitz

    Published Online : 15 JAN 2013, DOI: 10.1002/14356007.a24_427.pub2

  13. Scanning Electron Microscopy Observations of Failures of Implant Overdenture Bars: A Case Series Report

    Clinical Implant Dentistry and Related Research

    Volume 12, Issue 1, March 2010, Pages: 26–38, J. Neil Waddell, Alan GT Payne, Michael V. Swain and Jules A. Kieser

    Version of Record online : 17 OCT 2008, DOI: 10.1111/j.1708-8208.2008.00127.x

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    Optimization of Material and Process for Fine Pitch LVSoP Technology

    ETRI Journal

    Volume 35, Issue 4, August 2013, Pages: 625–631, Yong-Sung Eom, Ji-Hye Son, Hyun-Cheol Bae, Kwang-Seong Choi and Heung-Soap Choi

    Version of Record online : 30 AUG 2013, DOI: 10.4218/etrij.13.1912.0007

  15. Joining and Interconnect Formation of Nanowires and Carbon Nanotubes for Nanoelectronics and Nanosystems

    Small

    Volume 5, Issue 11, June 5, 2009, Pages: 1246–1257, Qingzhou Cui, Fan Gao, Subhadeep Mukherjee and Zhiyong Gu

    Version of Record online : 22 APR 2009, DOI: 10.1002/smll.200801551

  16. Packaging Technology

    Standard Article

    Encyclopedia of Applied Physics

    John J. Ritsko

    Published Online : 15 APR 2003, DOI: 10.1002/3527600434.eap305

  17. Numerical modeling and optimization of laser soldering for Micro-USB electric connector

    International Journal of Numerical Modelling: Electronic Networks, Devices and Fields

    Volume 28, Issue 2, March/April 2015, Pages: 175–188, Zhi Zeng, Xunbo Li, Rui Wang and Miao Li

    Version of Record online : 8 APR 2014, DOI: 10.1002/jnm.1995

  18. Biodegradable polymer scaffold, semi-solid solder, and single-spot lasing for increasing solder-tissue bonding in suture-free laser-assisted vascular repair

    Journal of Tissue Engineering and Regenerative Medicine

    Volume 6, Issue 10, November 2012, Pages: 803–812, Dara R. Pabittei, Michal Heger, Marc Simonet, Sjoerd van Tuijl, Allard C. van der Wal, Johan F. Beek, Ron Balm and Bas A. de Mol

    Version of Record online : 25 NOV 2011, DOI: 10.1002/term.486

  19. From cells to laminate: probing and modeling residual stress evolution in thin silicon photovoltaic modules using synchrotron X-ray micro-diffraction experiments and finite element simulations

    Progress in Photovoltaics: Research and Applications

    Volume 25, Issue 9, September 2017, Pages: 791–809, Sasi Kumar Tippabhotla, Ihor Radchenko, W.J.R. Song, Gregoria Illya, Vincent Handara, Martin Kunz, Nobumichi Tamura, Andrew A.O. Tay and Arief S. Budiman

    Version of Record online : 12 APR 2017, DOI: 10.1002/pip.2891

  20. Reflow and Electrical Characteristics of Nanoscale Solder

    Small

    Volume 2, Issue 2, February 2006, Pages: 225–229, Zhiyong Gu, Hongke Ye, Diana Smirnova, David Small and David H. Gracias

    Version of Record online : 9 JAN 2006, DOI: 10.1002/smll.200500296