Lead-free Electronics

Lead-free Electronics

Editor(s): Sanka Ganesan, Michael Pecht

Published Online: 22 FEB 2006

Print ISBN: 9780471786177

Online ISBN: 9780470007808

DOI: 10.1002/047000780X

About this Book

Lead-free Electronics provides guidance on the design and use of lead-free electronics as well as technical and legislative perspectives. All the complex challenges confronting the elec-tronics industry are skillfully addressed:
* Complying with state legislation
* Implementing the transition to lead-free electronics, including anticipating associated costs and potential supply chain issues
* Understanding intellectual property issues in lead-free alloys and their applications, including licensing and infringement
* Implementing cost effective manufacturing and testing
* Reducing risks due to tin whiskers
* Finding lead-free solutions in harsh environments such as in the automotive and telecommunications industries
* Understanding the capabilities and limitations of conductive adhesives in lead-free interconnects
* Devising solutions for lead-free, flip-chip interconnects in high-performance integrated circuit products

Each chapter is written by leading experts in the field and carefully edited to ensure a consistent approach. Readers will find all the latest information, including the most recent data on cyclic thermomechanical deformation properties of lead-free SnAgCu alloys and a comparison of the properties of standard Sn-Pb versus lead-free alloys, using the energy partitioning approach.

With legislative and market pressure to eliminate the use of lead in electronics manufacturing, this timely publication is essential reading for all engineers and professionals in the electronics industry.

Table of contents

    1. You have free access to this content
    2. Chapter 1

      Lead-free Electronics: Overview (pages 1–44)

      Richard Ciocci, Michael Pecht and Sanka Ganesan

    3. Chapter 4

      Lead-free Manufacturing (pages 101–138)

      Srinivas Rao, Jasbir Bath and Harjinder Ladhar

    4. Chapter 5

      Review of Lead-free Solder Joint Reliability (pages 139–235)

      Sanka Ganesan, Jing Song Xie, Haiyu Qi and Michael Osterman

    5. Chapter 10

      Tin Whiskers in Electronics (pages 551–625)

      Yuki Fukuda, Tong Fang, Sanka Ganesan, Michael Osterman and Michael Pecht

    6. Chapter 13

      Costs to Lead-free Migration (pages 683–696)

      Richard Ciocci, Michael Pecht and Sanka Ganesan

    7. Chapter 15

      Guidelines for Implementing Lead-free Electronics (pages 725–758)

      Valérie Eveloy, Sanka Ganesan, Yuki Fukuda, Ji Wu and Michael Pecht

    8. You have free access to this content

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