Microelectronic Applications of Chemical Mechanical Planarization

Microelectronic Applications of Chemical Mechanical Planarization

Editor(s): Yuzhuo Li

Published Online: 23 MAR 2007

Print ISBN: 9780471719199

Online ISBN: 9780470180907

DOI: 10.1002/9780470180907

About this Book

An authoritative, systematic, and comprehensive description of current CMP technology

Chemical Mechanical Planarization (CMP) provides the greatest degree of planarization of any known technique. The current standard for integrated circuit (IC) planarization, CMP is playing an increasingly important role in other related applications such as microelectromechanical systems (MEMS) and computer hard drive manufacturing. This reference focuses on the chemical aspects of the technology and includes contributions from the foremost experts on specific applications. After a detailed overview of the fundamentals and basic science of CMP, Microelectronic Applications of Chemical Mechanical Planarization:

Provides in-depth coverage of a wide range of state-of-the-art technologies and applications

Presents information on new designs, capabilities, and emerging technologies, including topics like CMP with nanomaterials and 3D chips

Discusses different types of CMP tools, pads for IC CMP, modeling, and the applicability of tribometrology to various aspects of CMP

Covers nanotopography, CMP performance and defect profiles, CMP waste treatment, and the chemistry and colloidal properties of the slurries used in CMP

Provides a perspective on the opportunities and challenges of the next fifteen years

Complete with case studies, this is a valuable, hands-on resource for professionals, including process engineers, equipment engineers, formulation chemists, IC manufacturers, and others. With systematic organization and questions at the end of each chapter to facilitate learning, it is an ideal introduction to CMP and an excellent text for students in advanced graduate courses that cover CMP or related semiconductor manufacturing processes.

Table of contents

    1. You have free access to this content
    2. Chapter 5

      Pads for IC CMP (pages 123–170)

      Changxue Wang, Ed Paul, Toshihiro Kobayashi and Yuzhuo Li

    3. Chapter 6

      Modeling (pages 171–200)

      Leonard Borucki and Ara Philipossian

    4. Chapter 15

      Three-Dimensional (3D) Integration (pages 431–465)

      J. Jay McMahon, Jian-Qiang Lu and Ronald J. Gutmann

    5. Chapter 16

      Post-CMP Cleaning (pages 467–509)

      Jin-Goo Park, Ahmed A. Busnaina and Yi-Koan Hong

    6. You have free access to this content