Handbook of Cleaning in Semiconductor Manufacturing: Fundamental and Applications

Handbook of Cleaning in Semiconductor Manufacturing: Fundamental and Applications

Editor(s): Karen A. Reinhardt, Richard F. Reidy

Published Online: 22 FEB 2011 10:07AM EST

Print ISBN: 9780470625958

Online ISBN: 9781118071748

DOI: 10.1002/9781118071748

About this Book

This comprehensive volume provides an in-depth discussion of the fundamentals of cleaning and surface conditioning of semiconductor applications such as high-k/metal gate cleaning, copper/low-k cleaning, high dose implant stripping, and silicon and SiGe passivation. The theory and fundamental physics associated with wet etching and wet cleaning is reviewed, plus the surface and colloidal aspects of wet processing. Formulation development practices and methodology are presented along with the applications for preventing copper corrosion, cleaning aluminum lines, and other sensitive layers. This is a must-have reference for any engineer or manager associated with using or supplying cleaning and contamination free technologies for semiconductor manufacturing.

From the Reviews...

"This handbook will be a valuable resource for many academic libraries. Many engineering librarians who work with a variety of programs (including, but not limited to Materials Engineering) should include this work in their collection. My recommendation is to add this work to any collection that serves a campus with a materials/manufacturing/electrical/computer engineering programs and campuses with departments of physics and/or chemistry with large graduate-level enrollment."
-Randy Wallace, Department Head, Discovery Park Library, University of North Texas

Table of contents

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  1. Part I: Fundamentals

    1. Chapter 5

      Fundamental Design of Chemical Formulations (pages 169–192)

      Robert J. Rovito, Michael B. Korzenski, Ping Jiang and Karen A. Reinhardt

  2. Part II: Applications

    1. Chapter 7

      Cleaning Challenges of High-κ/Metal Gate Structures (pages 237–284)

      Muhammad M. Hussain, Denis Shamiryan, Vasile Paraschiv, Kenichi Sano and Karen A. Reinhardt

    2. Chapter 10

      Low-κ/Cu Cleaning and Drying (pages 355–394)

      Karen A. Reinhardt, Richard F. Reidy and Jerome Daviot

    3. Chapter 14

      Direct Wafer Bonding Surface Conditioning (pages 501–541)

      Hubert Moriceau, Yannick C. Le Tiec, Frank Fournel, Ludovic F. L. Ecarnot, Sébastien L. E. Kerdilès, Daniel Delprat and Christophe Maleville

  3. Part III: New Directions

    1. You have free access to this content
    1. You have free access to this content

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