Copper: Better Properties for Innovative Products

Copyright © 2006 Wiley-VCH Verlag GmbH & Co. KGaA

Copper: Better Properties for Innovative Products

Editor(s): Jean-Marie Welter

Published Online: 16 JAN 2007

Print ISBN: 9783527318841

Online ISBN: 9783527610327

DOI: 10.1002/9783527610327

About this Book

Product Information

About The Product

Copper was since ever the companion of the development of mankind. Notwithstanding this long history, copper as we know it today is a rather young material. Indeed, the discovery and use of electricity during the 19th century led to a repositioning of copper and opened fantastic opportunities. It started a new career as the metal for generating, transporting and using energy, power and information.
This book contains the Proceedings of the International Conference "Copper '06". It gives a broad and up-to-date overview on the recent progress in research and development of copper and copper alloys for usage in modern industrial applications. The current challenges and changes in the international copper industry are also highlighted and the reader gets insight in the driving forces on the international copper market.

Table of contents

    1. You have free access to this content
      Front Matter (pages I–XII)

  2. Part 1: Oral Presentations - Invited Speakers

    1. Chapter 1

      Copper on the Move – Where it Comes from, Where it Goes to (pages 1–17)

      Martin Ruhrberg

    2. Copper and Venus: How do Copper Atoms Interact? (pages 18–24)

      Olivier Hardouin Duparc

  3. Part 1: Oral Presentations - Session 1 - Bulk Processing: Impact on Properties

    1. Mechanical and Corrosion Properties of ECAP Processed Copper (pages 25–33)

      Y. Estrin, R. J. Hellmig, M. Janecek, B. Hadzima and A. Zi

    2. The Influence of Pre-Ageing, Temperature and Strain Rate on low Cycle and Thermo-Mechanical Fatigue of CuCo2Be (pages 34–43)

      B. Prillhofer, M. Riedler and W. Eichlseder

    3. Texture and Microstructure Control of Cu and Cu-Zn Alloy by Differential Speed Rolling (pages 44–49)

      Dr. Tetsuo Sakai, Junya Watanabe, Naoaki Iwamoto and Hiroshi Utsunomiya

    4. Etude de la Recristallisation du Bronze Cu-6(%masse)SnP (pages 50–55)

      Fayçal Sadi, Yves Bienvenu and Philippe Bertrand

    5. Relationship Between Metallurgy, Process and Properties of Cast Copper Alloys (pages 56–62)

      Michel Stucky

  4. Part 1: Oral Presentations - Session 2 - New Products: Thin Films, Nano, Amorphous

    1. Metastable Ordered Cu3Al Phase in Sputter-Deposited Al-Cu Alloys System (pages 65–70)

      M. Draissia, M. Y. Debili, N. Boukhris, M. Zadam and S. Lallouche

    2. Mechanical Behaviour of Sintered Nanostructured Copper (pages 71–76)

      Yannick Champion, Sandrine Guérin and Cécilie Duhamel

  5. Part 1: Oral Presentations - Session 3 - Microstructures

    1. Thermophysical Properties and Microstructural Investigations of Copper-Copper Oxide Composites (pages 79–85)

      E. Neubauer, P. Angerer, A. Altenburger and G. Korb

    2. Precipitation in CuNi15wt%Sn8wt% and CuNi6wt%Si1.8wt% Alloys (pages 86–92)

      V. Lebreton, F. Barbeau and Y. Bienvenu

    3. Investigations on the Precipitation Sequence of CuNi2Si-Alloys (pages 93–100)

      Joachim Kinder and Jörg Fischer-Bühner

    4. Chapter 13

      Deformation and Recrystallization Textures and Microstructures in Cold-Drawn Copper (pages 101–107)

      T. Baudin, A. L. Etter, M. H. Mathon, S. Jakani, P. Gerber, D. Solas and R. Penelle

    5. Study of the Recrystallization Behaviour of Cu Added with Increasing Contents of P by Differential Scanning Calorimetry (DSC) and by Metallographic Examination (pages 108–115)

      Elena Martellucci, Niccolò Ammannati, Paolo Piccardo and Francesco. Piana

  6. Part 1: Oral Presentations - Session 4 - Corrosion

    1. Non-Toxic Copper Corrosion Inhibitors in Different Aggressive Media (pages 119–124)

      E. Stupnišek-Lisac and Helena Otmačić

    2. Formicary Corrosion of Copper Tubes after two Months in Service (pages 125–129)

      D. M. Bastidas, E. Cano, L. Bello and J. M. Bastidas

    3. A Study of Copper and Copper Alloys Runoff in Urban Atmosphere (pages 130–136)

      M. T. Sougrati, S. Jouen, B. Hannoyer and A. Barbier

    4. Explanation of Tin Role in the High Temperature Oxidation Resistance of Bronzes (pages 137–143)

      François Mathis, Marc Aucouturier and Patrick Trocellier

    5. Investigations into the Dezincification of α-Brass (pages 144–152)

      Bevis Hutchinson, James Oliver, Eva Lindh-Ulmgren and Eugenia Symniotis

    6. Intergranular Corrosion (IGA) of Brass (pages 153–163)

      Rolf Sundberg, Staffan Hertzman and Mats Linder

  7. Part 1: Oral Presentations - Session 5 - Applications

    1. Domestic Design Development 1806-2006 (pages 166–178)

      Vin Callcut

  8. Part 1: Oral Presentations - Session 5 – Applications

    1. High Temperature Properties of Bi-Containing Copper Alloys for Plumbing Applications (pages 179–184)

      M. Sadayappan, J. P. Thomson, M. Sahoo and H. T. Michels

    2. Development of ECOBRASS® Castings with Fine Grain (pages 185–193)

      Keiichiro Oishi and Yoshiyuki Goto

    3. Development of Cu[BOND]Al[BOND]Mn-Based Shape Memory Alloys (pages 194–202)

      T. Omori, Y. Sutou, R. Kainuma and K. Ishida

    4. Advantages of the Copper Rotor Motor – Performance, Energy Savings and Environmental (pages 203–210)

      Dale T. Peters, John G. Cowie and Edwin F. Brush

    5. Bendability of Strip Material: A Key Issue for Connector Applications (pages 211–216)

      Dr. Isabell Buresch, Dr. Uwe Hofmann and Dr. Stefan Theobald

    6. An Overview of the International Copper Association's Pre-Competitive R&D Portfolio of Copper-Related Technologies (pages 217–220)

      Suresh Sunderrajan

    7. An Online Resource for Inspiring Designers to Use Copper (pages 221–224)

      A. L. Chabrillat

  9. Part 2: Abstracts for Oral Contributions

    1. Abstracts for Oral Contributions (pages 227–230)

      D. A. Luzhbin, E. A. Bondar, E. Donoso, M. J. Diánez, M. J. Sayagués, J. M. Criado, A. Varschavsky, G. Díaz, M. N. Shalaby, M. M. Osman, P. V. Strekalov, Yu. M. Panchenko, A. Borhan, Dr. J-M. Welter, T. Helmenkamp, U. Adler and C. Bertin

  10. Part 3: Poster Presentations

    1. Mechanical and Metallurgical Properties of Joining Cu/Ag Applied Transient Liquid Phase Diffusion Bonding (pages 233–239)

      A. Araee and J. Senkara

    2. Interdiffusion in the Copper-Zinc System: Microstructure Development and Mechanical Behaviour of Composite Wires (pages 240–247)

      A. Deraisme, Y. Bienvenu and T. Dupuy

    3. Morphological Stability of Liquid-Solid Interface in some Copper-Aluminium Alloys (pages 248–252)

      N. Boukhris, M. Y. Debili, P. G. Fournier and M. Draissia

    4. Phase Transformation and Microstrain Study of Nanostructured Copper-Aluminium Thin Films (pages 253–259)

      S. Lallouche, M. Draissia and M. Y. Debili

    5. Formation of an Icosahedral Structure during Crystallization of Copper Nanoclusters (pages 260–266)

      S. L. Gafner, J. J. Gafner and S. V. Kosterin

    6. Temperature Dependent Elastic and Thermal Properties of Thin Copper Foils (pages 267–274)

      G. Khatibi, P. Zimprich, A. Betzwar-Kotas, M. Lederer and B. Weiss

    7. The Study of Microstructural Changes and Effects of Deformation Localization in Copper Alloys at Shock Waves Loading (pages 275–282)

      I.V. Khomskaya, V.I. Zel'dovich, B.V. Litvinov and N. P. Purigin

    8. In-situ Transmission Electron Microscopy Study of “Dislocation/Grain Boundary” Interactions in Copper (pages 283–287)

      J.-P. Couzinié, B. Décamps, F. Pettinari-Sturmel and L. Priester

    9. An Experimental Study of Transient Liquid Phase Bonding in the Silver-Copper System: to Understand the Craftsmanship of Ancient Silver Forgeries (pages 288–294)

      A. Deraisme, Y. Bienvenu, G. Frot and J.-N. Barrandon

    10. Microstructure/Tensile Properties Relationships in Cu-Ni-Sn Alloys (pages 295–300)

      Fayçal Sadi, Yves Bienvenu and Philippe Bertrand

    11. An Analytical Approach of Century Years old Copper Patinas (pages 301–306)

      J. Kasparek, A. Barbier and S Jouen

    12. Development of Superelastic Guidewire with Functionally Graded Property Using Cu-Al-Mn-Based Shape Memory Alloy (pages 307–313)

      Y. Sutou, T. Omori, M. Suzuki, A. Furukawa, K. Yamauchi, R. Kainuma and K. Ishida

    13. Dynamic Embrittlement in a Cu-Ni-Si Alloy (pages 314–320)

      Z. Sun, C. Laitem and A. Vincent

    14. Resitance à la Corrision des Alliages Utilisés Comme Implants en Milieu Biologique: The Corrosion Resistance of Copper in Physiological Medium (pages 321–325)

      H. Chaouki, A. Chtaini and A. El Bouadili

    1. You have free access to this content
      Authors (pages 327–328)

    1. You have free access to this content
      Subject Index (pages 329–332)

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