Handbook of Wafer Bonding
Copyright © 2012 Wiley-VCH Verlag GmbH & Co. KGaA
Editor(s): Peter Ramm, James Jian-Qiang Lu, Maaike M. V. Taklo
Published Online: 8 FEB 2012 06:31AM EST
Print ISBN: 9783527326464
Online ISBN: 9783527644223
About this Book
The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration, temporary bonding and micro-electro-mechanical systems (MEMS) with new functional layers. Written by authors and edited by a team from microsystems companies and industry-near research organizations, this handbook and reference presents dependable, first-hand information on bonding technologies.
Part I sorts the wafer bonding technologies into four categories: Adhesive and Anodic Bonding; Direct Wafer Bonding; Metal Bonding; and Hybrid Metal/Dielectric Bonding. Part II summarizes the key wafer bonding applications developed recently, that is, 3D integration, MEMS, and temporary bonding, to give readers a taste of the significant applications of wafer bonding technologies.
This book is aimed at materials scientists, semiconductor physicists, the semiconductor industry, IT engineers, electrical engineers, and libraries.