Handbook of Wafer Bonding

Copyright © 2012 Wiley-VCH Verlag GmbH & Co. KGaA

Handbook of Wafer Bonding

Editor(s): Peter Ramm, James Jian-Qiang Lu, Maaike M. V. Taklo

Published Online: 8 FEB 2012 06:31AM EST

Print ISBN: 9783527326464

Online ISBN: 9783527644223

DOI: 10.1002/9783527644223

About this Book

Product Information

About The Product

Written by an author and editor team from microsystems companies and industry-near research organizations, this handbook and reference presents dependable, first-hand information on bonding technologies.
In the first part, researchers from companies and institutions around the world discuss the most reliable and reproducible technologies for the production of bonded wafers. The second part is devoted to current and emerging applications, including microresonators, biosensors and precise measuring devices.

Table of contents

    1. You have free access to this content
      Front Matter (pages I–XXXI)

  2. Part One: Technologies - A.: Adhesive and Anodic Bonding

    1. Chapter 1

      Glass Frit Wafer Bonding (pages 1–17)

      Roy Knechtel

    2. Chapter 2

      Wafer Bonding Using Spin-On Glass as Bonding Material (pages 19–32)

      Viorel Dragoi

    3. Chapter 3

      Polymer Adhesive Wafer Bonding (pages 33–61)

      Frank Niklaus and Jian-Qiang Lu

    4. Chapter 4

      Anodic Bonding (pages 63–80)

      Adriana Cozma Lapadatu and Kari Schjølberg-Henriksen

  3. Part One: Technologies - B.: Direct Wafer Bonding

    1. Chapter 5

      Direct Wafer Bonding (pages 81–100)

      Manfred Reiche and Ulrich Gösele

    2. Chapter 6

      Plasma-Activated Bonding (pages 101–118)

      Maik Wiemer, Dirk Wuensch, Joerg Braeuer and Thomas Gessner

  4. Part One: Technologies - C.: Metal Bonding

    1. Chapter 7

      Au/Sn Solder (pages 119–138)

      Hermann Oppermann and Matthias Hutter

    2. Chapter 8

      Eutectic Au[BOND]In Bonding (pages 139–159)

      Mitsumasa Koyanagi and Makoto Motoyoshi

    3. Chapter 9

      Thermocompression Cu[BOND]Cu Bonding of Blanket and Patterned Wafers (pages 161–180)

      Kuan-Neng Chen and Chuan Seng Tan

    4. Chapter 10

      Wafer-Level Solid–Liquid Interdiffusion Bonding (pages 181–214)

      Nils Hoivik and Knut Aasmundtveit

  5. Part One: Technologies - D.: Hybrid Metal/Dielectric Bonding

    1. Chapter 11

      Hybrid Metal/Polymer Wafer Bonding Platform (pages 215–236)

      Jian-Qiang Lu, J. Jay McMahon and Ronald J. Gutmann

    2. Chapter 12

      Cu/SiO2 Hybrid Bonding (pages 237–259)

      Léa Di Cioccio

    3. Chapter 13

      Metal/Silicon Oxide Hybrid Bonding (pages 261–278)

      Paul Enquist

  6. Part Two: Applications

    1. Chapter 14

      Microelectromechanical Systems (pages 279–299)

      Dr. Maaike M. V. Taklo

    2. Chapter 15

      Three-Dimensional Integration (pages 301–328)

      Philip Garrou, Prof. Dr. James Jian-Qiang Lu and Dr. Peter Ramm

    3. Chapter 16

      Temporary Bonding for Enabling Three-Dimensional Integration and Packaging (pages 329–345)

      Rama Puligadda

    4. Chapter 17

      Temporary Adhesive Bonding with Reconfiguration of Known Good Dies for Three-Dimensional Integrated Systems (pages 347–354)

      Armin Klumpp and Dr. Peter Ramm

    5. Chapter 18

      Thin Wafer Support System for above 250°C Processing and Cold De-Bonding (pages 355–365)

      Werner Pamler and Franz Richter

    6. Chapter 19

      Temporary Bonding: Electrostatic (pages 367–384)

      Christof Landesberger, Armin Klumpp and Karlheinz Bock

    1. You have free access to this content
      Index (pages 385–395)

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