Handbook of Wafer Bonding

Handbook of Wafer Bonding

Editor(s): Peter Ramm, James Jian-Qiang Lu, Maaike M. V. Taklo

Published Online: 8 FEB 2012 06:31AM EST

Print ISBN: 9783527326464

Online ISBN: 9783527644223

DOI: 10.1002/9783527644223

About this Book

The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration, temporary bonding and micro-electro-mechanical systems (MEMS) with new functional layers. Written by authors and edited by a team from microsystems companies and industry-near research organizations, this handbook and reference presents dependable, first-hand information on bonding technologies.

Part I sorts the wafer bonding technologies into four categories: Adhesive and Anodic Bonding; Direct Wafer Bonding; Metal Bonding; and Hybrid Metal/Dielectric Bonding. Part II summarizes the key wafer bonding applications developed recently, that is, 3D integration, MEMS, and temporary bonding, to give readers a taste of the significant applications of wafer bonding technologies.

This book is aimed at materials scientists, semiconductor physicists, the semiconductor industry, IT engineers, electrical engineers, and libraries.

Table of contents

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  1. Part One: Technologies - A.: Adhesive and Anodic Bonding

    1. Chapter 4

      Anodic Bonding (pages 63–80)

      Adriana Cozma Lapadatu and Kari Schjølberg-Henriksen

  2. Part One: Technologies - B.: Direct Wafer Bonding

    1. Chapter 6

      Plasma-Activated Bonding (pages 101–118)

      Maik Wiemer, Dirk Wuensch, Joerg Braeuer and Thomas Gessner

  3. Part One: Technologies - C.: Metal Bonding

  4. Part One: Technologies - D.: Hybrid Metal/Dielectric Bonding

  5. Part Two: Applications

    1. Chapter 15

      Three-Dimensional Integration (pages 301–328)

      Philip Garrou, Prof. Dr. James Jian-Qiang Lu and Dr. Peter Ramm

    2. Chapter 19

      Temporary Bonding: Electrostatic (pages 367–384)

      Christof Landesberger, Armin Klumpp and Karlheinz Bock

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