Handbook of Wafer Bonding
Copyright © 2012 Wiley-VCH Verlag GmbH & Co. KGaA
Editor(s): Peter Ramm, James Jian-Qiang Lu, Maaike M. V. Taklo
Published Online: 8 FEB 2012 06:31AM EST
Print ISBN: 9783527326464
Online ISBN: 9783527644223
About this Book
Written by an author and editor team from microsystems companies and industry-near research organizations, this handbook and reference presents dependable, first-hand information on bonding technologies.
In the first part, researchers from companies and institutions around the world discuss the most reliable and reproducible technologies for the production of bonded wafers. The second part is devoted to current and emerging applications, including microresonators, biosensors and precise measuring devices.