Handbook of 3D Integration: 3D Process Technology

Handbook of 3D Integration: 3D Process Technology

Editor(s): Philip Garrou, Mitsumasa Koyanagi, Peter Ramm

Published Online: 20 JUN 2014 08:33PM EST

Print ISBN: 9783527334667

Online ISBN: 9783527670109

DOI: 10.1002/9783527670109

About this Book

Edited by key figures in 3D integration and written by top authors from high-tech companies and renowned research institutions, this book covers the intricate details of 3D process technology. As such, the main focus is on silicon via formation, bonding and debonding, thinning, via reveal and backside processing, both from a technological and a materials science perspective. The last part of the book is concerned with assessing and enhancing the reliability of the 3D integrated devices, which is a prerequisite for the large-scale implementation of this emerging technology.
Invaluable reading for materials scientists, semiconductor physicists, and those working in the semiconductor industry, as well as IT and electrical engineers.

Table of contents

    1. You have free access to this content
    2. Chapter 11

      ZoneBOND®: Recent Developments in Temporary Bonding and Room-Temperature Debonding (pages 159–166)

      Thorsten Matthias, Jürgen Burggraf, Daniel Burgstaller, Markus Wimplinger and Paul Lindner

    3. Chapter 16

      Backside Thinning and Stress-Relief Techniques for Thin Silicon Wafers (pages 207–226)

      Christof Landesberger, Christoph Paschke, Hans-Peter Spöhrle and Karlheinz Bock

    4. Chapter 22

      Cu–SiO2 Hybrid Bonding (pages 295–312)

      Léa Di Cioccio, S. Moreau, Loïc Sanchez, Floriane Baudin, Pierric Gueguen, Sebastien Mermoz, Yann Beilliard and Rachid Taibi

    5. Chapter 29

      Metrology Needs for 2.5D/3D Interconnects (pages 393–430)

      Victor H. Vartanian, Richard A. Allen, Larry Smith, Klaus Hummler, Steve Olson and Brian Sapp

    6. You have free access to this content