Chapter 4. Low-Temperature Co-Fired Ceramic Chip Carriers
- James K. Wessel Editor in chief
Published Online: 8 JUN 2004
Copyright © 2004 John Wiley & Sons, Inc.
Handbook of Advanced Materials: Enabling New Designs
How to Cite
Knickerbocker, J. U. and Knickerbocker, S. H. (2004) Low-Temperature Co-Fired Ceramic Chip Carriers, in Handbook of Advanced Materials: Enabling New Designs (ed J. K. Wessel), John Wiley & Sons, Inc., Hoboken, NJ, USA. doi: 10.1002/0471465186.ch4
Wessel & Associates, 127 Westview Lane, Oak Ridge, Tennessee 37830, USA
- Published Online: 8 JUN 2004
- Published Print: 16 APR 2004
Print ISBN: 9780471454755
Online ISBN: 9780471465188
- integral passive materials;
- aluminum oxide;
The 1990s brought revolutionary new technologies to computing and one such new technology has been that of multilayer ceramic interconnecting substrates. We have witnessed the transition from aluminum oxide and molybdenum or tungsten materials to much higher performance glass–ceramic and copper. In particular, cordierite glass–ceramics have enabled greater processing speeds due to their lower dielectric constants and copper's much higher electrical conductivity than traditional molybdenum, and tungsten has further aided signal speeds. And, new processing technologies have allowed greater dimensional control of the finished product, which in turn has permitted tighter tolerances and more advanced design ground rules. Additionally, the exceptional reliability of this technology has been demonstrated across many different form factors and applications.
This chapter reviews glass–ceramic/copper multilayer interconnect substrate technology. It reviews the fundamental materials properties as well as the key processing parameters. This chapter also reviews some future directions and challenges for this emerging technology in the new millennium.