4. Low-Temperature Co-Fired Ceramic Chip Carriers

  1. James K. Wessel Editor in chief
  1. John U. Knickerbocker and
  2. Sarah H. Knickerbocker

Published Online: 8 JUN 2004

DOI: 10.1002/0471465186.ch4

Handbook of Advanced Materials: Enabling New Designs

Handbook of Advanced Materials: Enabling New Designs

How to Cite

Knickerbocker, J. U. and Knickerbocker, S. H. (2004) Low-Temperature Co-Fired Ceramic Chip Carriers, in Handbook of Advanced Materials: Enabling New Designs (ed J. K. Wessel), John Wiley & Sons, Inc., Hoboken, NJ, USA. doi: 10.1002/0471465186.ch4

Editor Information

  1. Wessel & Associates, 127 Westview Lane, Oak Ridge, Tennessee 37830, USA

Author Information

  1. IBM, Inc., 208 Creamery Road, Hopewell Junction, New York 12533, USA

Publication History

  1. Published Online: 8 JUN 2004
  2. Published Print: 16 APR 2004

ISBN Information

Print ISBN: 9780471454755

Online ISBN: 9780471465188



  • ceramics;
  • dielectrics;
  • conductors;
  • metallization;
  • sintering;
  • test;
  • inspection;
  • properties;
  • integral passive materials;
  • substrates;
  • molybdenum;
  • tungsten;
  • aluminum oxide;
  • copper;
  • resistors;
  • capacitors


The 1990s brought revolutionary new technologies to computing and one such new technology has been that of multilayer ceramic interconnecting substrates. We have witnessed the transition from aluminum oxide and molybdenum or tungsten materials to much higher performance glass–ceramic and copper. In particular, cordierite glass–ceramics have enabled greater processing speeds due to their lower dielectric constants and copper's much higher electrical conductivity than traditional molybdenum, and tungsten has further aided signal speeds. And, new processing technologies have allowed greater dimensional control of the finished product, which in turn has permitted tighter tolerances and more advanced design ground rules. Additionally, the exceptional reliability of this technology has been demonstrated across many different form factors and applications.

This chapter reviews glass–ceramic/copper multilayer interconnect substrate technology. It reviews the fundamental materials properties as well as the key processing parameters. This chapter also reviews some future directions and challenges for this emerging technology in the new millennium.