7. Component Sockets for BGA Packages

  1. Weifeng Liu and
  2. Michael Pecht

Published Online: 28 JAN 2005

DOI: 10.1002/0471648272.ch7

IC Component Sockets

IC Component Sockets

How to Cite

Liu, W. and Pecht, M. (2004) Component Sockets for BGA Packages, in IC Component Sockets, John Wiley & Sons, Inc., Hoboken, NJ, USA. doi: 10.1002/0471648272.ch7

Publication History

  1. Published Online: 28 JAN 2005
  2. Published Print: 11 MAR 2004

ISBN Information

Print ISBN: 9780471460503

Online ISBN: 9780471648277

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Keywords:

  • BGA solder balls;
  • no-damage zone (NDZ);
  • pogo contact

Summary

This chapter contains sections titled:

  • Socket Designs

  • Summary

  • References