14. Space-Filling Curve High-Impedance Ground Planes

  1. Nader Engheta2 and
  2. Richard W. Ziolkowski3
  1. John McVay1,
  2. Nader Engheta2 and
  3. Ahmad Hoorfar1

Published Online: 20 SEP 2006

DOI: 10.1002/0471784192.ch14

Metamaterials: Physics and Engineering Explorations

Metamaterials: Physics and Engineering Explorations

How to Cite

McVay, J., Engheta, N. and Hoorfar, A. (2006) Space-Filling Curve High-Impedance Ground Planes, in Metamaterials: Physics and Engineering Explorations (eds N. Engheta and R. W. Ziolkowski), John Wiley & Sons, Inc., Hoboken, NJ, USA. doi: 10.1002/0471784192.ch14

Editor Information

  1. 2

    Department of Electrical and Systems Engineering, University of Pennsylvania, Philadelphia, Pennsylvania, USA

  2. 3

    Department of Electrical and Computer Engineering, University of Arizona, Tucson, Arizona, USA

Author Information

  1. 1

    Department of Electrical and Computer Engineering, Villanova University, Villanova, Pennsylvania, USA

  2. 2

    Department of Electrical and Systems Engineering, University of Pennsylvania, Philadelphia, Pennsylvania, USA

Publication History

  1. Published Online: 20 SEP 2006
  2. Published Print: 12 MAY 2006

ISBN Information

Print ISBN: 9780471761020

Online ISBN: 9780471784197

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Keywords:

  • space-filling curve high-impedance ground planes;
  • Peano and Hilbert space-filling curve inclusions;
  • space-filling curve element resonances

Summary

This chapter contains sections titled:

  • Resonances of Space-Filling Curve Elements

  • High-Impedance Surfaces Made of Space-Filling Curve Inclusions

  • Use of Space-Filling Curve High-Impedance Surfaces in Antenna Applications

  • Space-Filling Curve Elements as Inclusions in DNG Bulk Media

  • Conclusions

  • References