Development of a Low-Dielectric-Constant Polymer for the Fabrication of Integrated Circuit Interconnect
Version of Record online: 14 DEC 2000
© 2000 WILEY-VCH Verlag GmbH, Weinheim, Fed. Rep. of Germany
Volume 12, Issue 23, pages 1769–1778, December, 2000
How to Cite
Martin, S. J., Godschalx, J. P., Mills, M. E., Shaffer, E. O. and Townsend, P. H. (2000), Development of a Low-Dielectric-Constant Polymer for the Fabrication of Integrated Circuit Interconnect. Adv. Mater., 12: 1769–1778. doi: 10.1002/1521-4095(200012)12:23<1769::AID-ADMA1769>3.0.CO;2-5
- Issue online: 14 DEC 2000
- Version of Record online: 14 DEC 2000
- Manuscript Accepted: 16 OCT 2000
- Manuscript Received: 25 JUL 2000
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