Thermo-Mechanical Properties of Electrodeposited Ultra Fine Grained Cu-Foils for Printed Wiring Boards

  1. Prof. Dr. Michael Zehetbauer3 and
  2. Prof. Ruslan Z. Valiev4
  1. A. Betzwar-Kotas1,
  2. V. Gröger1,
  3. G. Khatibi1,2,
  4. B. Weiss1,
  5. I. Wottle1 and
  6. P. Zimprich1

Published Online: 28 JAN 2005

DOI: 10.1002/3527602461.ch11f

Nanomaterials by Severe Plastic Deformation

Nanomaterials by Severe Plastic Deformation

How to Cite

Betzwar-Kotas, A., Gröger, V., Khatibi, G., Weiss, B., Wottle, I. and Zimprich, P. (2004) Thermo-Mechanical Properties of Electrodeposited Ultra Fine Grained Cu-Foils for Printed Wiring Boards, in Nanomaterials by Severe Plastic Deformation (eds M. Zehetbauer and R. Z. Valiev), Wiley-VCH Verlag GmbH & Co. KGaA, Weinheim, FRG. doi: 10.1002/3527602461.ch11f

Editor Information

  1. 3

    Institut für Materialphysik, Universität Wien, Boltzmanngasse 5, 1090 Wien, Austria

  2. 4

    Institute of Physics of Advanced Materials, Ufa State Aviation Technical University, 12 K. Marks Str., Ufa, 450 000, Russia

Author Information

  1. 1

    Institute of Material Physics, University of Vienna, Austria

  2. 2

    Institute of Physical Chemistry, Material Science, University of Vienna, Austria

Publication History

  1. Published Online: 28 JAN 2005
  2. Published Print: 25 FEB 2004

ISBN Information

Print ISBN: 9783527306596

Online ISBN: 9783527602469



  • thermomechanical properties;
  • electrodeposited ultra fine grained foils;
  • Cu foils;
  • printed wiring boards;
  • nanocrystalline materials;
  • determinations of Young's modulus;
  • coefficient of thermal expansion (CTE)


Motivated by the remarkable mechanical properties of metals with grains in the submicrometer range there is a strong interest in methods for industrial production of nanocrystalline materials with favourable defect structures [1]. For severe plastic deformation under high hydrostatic pressure (up to now only laboratory production) this condition is certainly met. On the other hand electro-deposition methods are industrially widely in use and are able to produce nanocrystalline metals if the deposition parameters are chosen suitably which also causes a very particular defect structure. This investigation aims to contribute to find out if nanocrystalline electrodeposited foils might have mechanical advantages over similar materials with grains in the micrometer range. This will be done for the example of Cu foils of 35 µm; thickness which are widely in use for printed wiring boards. Detailed information about their microstructure is available and will be shortly outlined. For estimating the reliability Young's modulus and the coefficient of linear thermal expansion are of particular interest but as they are not easily determined for thin foils there is a severe lack of data. For the measurement of strain for determinations of Young's modulus (YM) and coefficient of thermal expansion (CTE) we use a contact free laser speckle correlation method.