Superplastic Behavior of Deformation Processed Cu-Ag Nanocomposites

  1. Prof. Dr. Michael Zehetbauer2 and
  2. Prof. Ruslan Z. Valiev3
  1. S. I. Hong,
  2. Y. S. Kim and
  3. H. S. Kim

Published Online: 28 JAN 2005

DOI: 10.1002/3527602461.ch13e

Nanomaterials by Severe Plastic Deformation

Nanomaterials by Severe Plastic Deformation

How to Cite

Hong, S. I., Kim, Y. S. and Kim, H. S. (2004) Superplastic Behavior of Deformation Processed Cu-Ag Nanocomposites, in Nanomaterials by Severe Plastic Deformation (eds M. Zehetbauer and R. Z. Valiev), Wiley-VCH Verlag GmbH & Co. KGaA, Weinheim, FRG. doi: 10.1002/3527602461.ch13e

Editor Information

  1. 2

    Institut für Materialphysik, Universität Wien, Boltzmanngasse 5, 1090 Wien, Austria

  2. 3

    Institute of Physics of Advanced Materials, Ufa State Aviation Technical University, 12 K. Marks Str., Ufa, 450 000, Russia

Author Information

  1. Department of Metallurgical Engineering, Chungnam National University, Taedok Science Town, Taejon, Korea

Publication History

  1. Published Online: 28 JAN 2005
  2. Published Print: 25 FEB 2004

ISBN Information

Print ISBN: 9783527306596

Online ISBN: 9783527602469



  • superplastic behavior;
  • Cu-Ag nanocomposites;
  • microstructural stability;
  • room temperature mechanical properties


Deformation processed Cu base nanocomposites possess high strength in excess of 1 GPa with a conductivity of 60–70 % IACS [1]. Recently, Hong and Hill [1] examined the microstructural stability of Cu-Ag nanocomposites at high temperatures and reported that extensive recrystallization occurred following heat treatment at 400 °C. They also observed that strength level decreased substantially for Cu-Ag nanocomposite heat treated at 400 °C. The room temperature ductility, however, did not improve even after the extensive recrystallization occurred upon annealing at 400 °C. One interesting observation by Hong and Hill [1] was that heat treating at 100 or 200 °C significantly reduced the ductility. High strength materials manifest limited tensile elongation due to flow localization even though some of them can be quite tough. The recovery/recrystallization occurs at and above 400 °C and the deformation behavior after recrystallization is expected to differ from that of the as-drawn Cu-Ag nanocomposites. However, much of the work on Cu-Ag nanocomposites has focused on room temperature mechanical properties and its relation to the microstructures [1–4].