On the Influence of Temperature and Strain Rate on the Flow Stress of ECAP Nickel

  1. Prof. Dr. Michael Zehetbauer3 and
  2. Prof. Ruslan Z. Valiev4
  1. L. Hollang1,
  2. E. Thiele1,
  3. C. Holste1 and
  4. D. Brunner2

Published Online: 28 JAN 2005

DOI: 10.1002/3527602461.ch3d

Nanomaterials by Severe Plastic Deformation

Nanomaterials by Severe Plastic Deformation

How to Cite

Hollang, L., Thiele, E., Holste, C. and Brunner, D. (2004) On the Influence of Temperature and Strain Rate on the Flow Stress of ECAP Nickel, in Nanomaterials by Severe Plastic Deformation (eds M. Zehetbauer and R. Z. Valiev), Wiley-VCH Verlag GmbH & Co. KGaA, Weinheim, FRG. doi: 10.1002/3527602461.ch3d

Editor Information

  1. 3

    Institut für Materialphysik, Universität Wien, Boltzmanngasse 5, 1090 Wien, Austria

  2. 4

    Institute of Physics of Advanced Materials, Ufa State Aviation Technical University, 12 K. Marks Str., Ufa, 450 000, Russia

Author Information

  1. 1

    Institut für Physikalische Metallkunde, Technische Universität Dresden, Germany

  2. 2

    Max-Planck-Institut für Metallforschung, Stuttgart, Germany

Publication History

  1. Published Online: 28 JAN 2005
  2. Published Print: 25 FEB 2004

ISBN Information

Print ISBN: 9783527306596

Online ISBN: 9783527602469

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Keywords:

  • severe plastic deformation (SPD);
  • temperature influence;
  • strain rate influence;
  • flow stress of ECAP nickel

Summary

Severe plastic deformation (SPD) by equal-channel angular pressing (ECAP) is one of the most efficient methods to produce sub-microcrystalline materials with grain-sizes in the range 0.1 to 1 µm. ECAP materials are dense bulk materials whose structural parameters can be adjusted widely by varying the processing parameter as processing temperature, die geometry, and processing route. Accordingly, the structure and the properties of ECAP materials have been the subject of numerous investigations. However, there are little attempts to use the thermal activation analysis to determine the elementary processes governing the plastic behavior of ECAP materials. The aim of the present paper is to show that thermal activation analysis is a useful tool to characterize the SPD state.