Thin Film and Interface Analysis of Microprocessor Device Structures – Requirements and Practical Examples

  1. Prof. T. W. Clyne and
  2. F. Simancik
  1. Ehrenfried Zschech,
  2. Hans-Jürgen Engelmann,
  3. Werner Blum and
  4. Cornelia Weiss

Published Online: 21 DEC 2005

DOI: 10.1002/3527606203.ch13

Metal Matrix Composites and Metallic Foams, Volume 5

Metal Matrix Composites and Metallic Foams, Volume 5

How to Cite

Zschech, E., Engelmann, H.-J., Blum, W. and Weiss, C. (2005) Thin Film and Interface Analysis of Microprocessor Device Structures – Requirements and Practical Examples, in Metal Matrix Composites and Metallic Foams, Volume 5 (eds T. W. Clyne and F. Simancik), Wiley-VCH Verlag GmbH & Co. KGaA, Weinheim, FRG. doi: 10.1002/3527606203.ch13

Editor Information

  1. Department of Materials Science and Metallurgy, Cambridge University, Pembroke Street, Cambridge CB2 3QZ, U.K.

Author Information

  1. AMD Saxony Manufacturing GmbH, Dresden, Germany

Publication History

  1. Published Online: 21 DEC 2005
  2. Published Print: 20 APR 2000

Book Series:

  1. EUROMAT 99

ISBN Information

Print ISBN: 9783527301263

Online ISBN: 9783527606207

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Keywords:

  • thin films;
  • interface analysis of microprocessor device structures

Summary

The objective of the present paper is to compare destructive and nondestructive techniques for blanket wafer thin film analysis, and to show the advantages of recently developed analytical techniques with nanometer resolution that have been applied for physical failure analysis at real device structure, using a transmission electron microscope.