Development of Cu/Cu Interconnections Using an Indium Interlayer
- Prof. T. W. Clyne and
- F. Simancik
Published Online: 21 DEC 2005
Copyright © 2000 Wiley-VCH Verlag GmbH, Weinheim
Metal Matrix Composites and Metallic Foams, Volume 5
How to Cite
Sommadossi, S., Khanna, P.K., Bhatnagar, S.K., Lityńska, L., Zięba, P., Gust, W. and Mittemijer, E.J. (2000) Development of Cu/Cu Interconnections Using an Indium Interlayer, in Metal Matrix Composites and Metallic Foams, Volume 5 (eds T. W. Clyne and F. Simancik), Wiley-VCH Verlag GmbH & Co. KGaA, Weinheim, FRG. doi: 10.1002/3527606203.ch38
Department of Materials Science and Metallurgy, Cambridge University, Pembroke Street, Cambridge CB2 3QZ, U.K.
- Published Online: 21 DEC 2005
- Published Print: 20 APR 2000
Print ISBN: 9783527301263
Online ISBN: 9783527606207
- Cu/Cu interconnections;
- indium underlayer
The objective of the present paper was to study indium as solder material for the fabrication of Cu/In/Cu joints. According to the Cu-In phase diagram (see Fig. 1), it can be expected that if the δ(Cu7In3) and η(Cu7In4) intermetallic phases are formed during soldering in the bond area, then the bond is thermally stable up to approximately 631 °C. The presence of the Cu11In9 phase should be avoided owing to the relatively low melting temperature (307 °C).