Novel Ni/Al/Ni Diffusion Soldered Joints for High Temperature Applications

  1. Prof. T. W. Clyne and
  2. F. Simancik
  1. P.K. Khanna2,
  2. S. Sommadossi1,
  3. G. Lopez1,
  4. E. Bielańska3,
  5. P. Zięba3,
  6. L.S. Chang4,
  7. W. Gust1 and
  8. E.J. Mittemijer1

Published Online: 21 DEC 2005

DOI: 10.1002/3527606203.ch39

Metal Matrix Composites and Metallic Foams, Volume 5

Metal Matrix Composites and Metallic Foams, Volume 5

How to Cite

Khanna, P.K., Sommadossi, S., Lopez, G., Bielańska, E., Zięba, P., Chang, L.S., Gust, W. and Mittemijer, E.J. (2000) Novel Ni/Al/Ni Diffusion Soldered Joints for High Temperature Applications, in Metal Matrix Composites and Metallic Foams, Volume 5 (eds T. W. Clyne and F. Simancik), Wiley-VCH Verlag GmbH & Co. KGaA, Weinheim, FRG. doi: 10.1002/3527606203.ch39

Editor Information

  1. Department of Materials Science and Metallurgy, Cambridge University, Pembroke Street, Cambridge CB2 3QZ, U.K.

Author Information

  1. 1

    Max Planck Institute for metals Research and Institute for physical Metallurgy, University of Stuttgart, Stuttgart, Germany

  2. 2

    Central Electronics Engineering Research Institute, Pilani, Rajasthan, India

  3. 3

    Institute of Metallurgy and Materials Science, Polish Academy of Sciences, Cracow, Poland

  4. 4

    Institute of Materials Engineering, National Chung-Hsing University, Taichung, Taiwan, R.O.C

Publication History

  1. Published Online: 21 DEC 2005
  2. Published Print: 20 APR 2000

Book Series:

  1. EUROMAT 99

ISBN Information

Print ISBN: 9783527301263

Online ISBN: 9783527606207

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Keywords:

  • Ni/Al/Ni diffusion joints;
  • high temperature applications

Summary

For the first time, the application of the isothermal solidification principle for the formation of high-temperature resistant, stable Ni/Al/Ni interconnections is reported in this paper.