MoCu and WCu Alloys for MM-Wave Packaging

  1. Dr. K. Grassie3,
  2. Prof. Dr. E. Teuckhoff4,
  3. Prof. Dr. G. Wegner5,
  4. Prof. Dr. J. Hausselt6 and
  5. Prof. Dr. H. Hanselka7
  1. M. Knüwer1,
  2. T. Wiefel2 and
  3. K.-H. Wichmann2

Published Online: 27 APR 2006

DOI: 10.1002/3527607420.ch11

Functional Materials, Volume 13

Functional Materials, Volume 13

How to Cite

Knüwer, M., Wiefel, T. and Wichmann, K.-H. (2000) MoCu and WCu Alloys for MM-Wave Packaging, in Functional Materials, Volume 13 (eds K. Grassie, E. Teuckhoff, G. Wegner, J. Hausselt and H. Hanselka), Wiley-VCH Verlag GmbH & Co. KGaA, Weinheim, FRG. doi: 10.1002/3527607420.ch11

Editor Information

  1. 3

    Philips Forschungslaboratorium, Postfach 500145, 52085 Aachen, Germany

  2. 4

    Siemens AG, Postfach 3240, 91050 Erlangen, Germany

  3. 5

    Max-Planck-Institut für Polymerforschung, Ackermannweg 10, 55128 Mainz, Germany

  4. 6

    Forschungszentrum Karlsruhe, Postfach 3640, 76201 Karlsruhe, Germany

  5. 7

    Institut für Mechanik, Otto-von-Guericke-Universität Magdeburg, Universitätsplatz 2, 39160 Magdeburg, Germany

Author Information

  1. 1

    Fraunhofer-Institut für Angewandte Materialforschung (IFAM), Bremen (Germany)

  2. 2

    DaimlerChrysler Aerospace AG, Ulm (Germany)

Publication History

  1. Published Online: 27 APR 2006
  2. Published Print: 27 JUN 2000

Book Series:

  1. EUROMAT 99

ISBN Information

Print ISBN: 9783527302543

Online ISBN: 9783527607426

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Keywords:

  • functional materials;
  • MoCu and WCu alloys for MM-wave packaging

Summary

Pseudo alloys of the systems Mo-Cu and W-Cu includes the required physical properties concerning thermal expansion, thermal conductivity and mechanical capacitance. However, these materials cannot be produced by common metallurgical processes that only powder metallurgy comes into question. Moreover, compared with shaping by machine tool with removal of ships metal injection moulding technique as primary shaping method offers the advantage of a nearly free shaping of geometry with very low material waste. Compared with machining this renders considerable savings of costs at producing of millimeter-wave packagings possible.