Investigation of Interface Cracking in Electronic Packages

  1. Dr. K. Grassie3,
  2. Prof. Dr. E. Teuckhoff4,
  3. Prof. Dr. G. Wegner5,
  4. Prof. Dr. J. Hausselt6 and
  5. Prof. Dr. H. Hanselka7
  1. E. Kieselstein1,
  2. B. Seiler1,
  3. Th. Winkler1,
  4. R. Dudek2,
  5. J. Auersperg2,
  6. A. Schubert2 and
  7. B. Michel2

Published Online: 27 APR 2006

DOI: 10.1002/3527607420.ch14

Functional Materials, Volume 13

Functional Materials, Volume 13

How to Cite

Kieselstein, E., Seiler, B., Winkler, Th., Dudek, R., Auersperg, J., Schubert, A. and Michel, B. (2000) Investigation of Interface Cracking in Electronic Packages, in Functional Materials, Volume 13 (eds K. Grassie, E. Teuckhoff, G. Wegner, J. Hausselt and H. Hanselka), Wiley-VCH Verlag GmbH & Co. KGaA, Weinheim, FRG. doi: 10.1002/3527607420.ch14

Editor Information

  1. 3

    Philips Forschungslaboratorium, Postfach 500145, 52085 Aachen, Germany

  2. 4

    Siemens AG, Postfach 3240, 91050 Erlangen, Germany

  3. 5

    Max-Planck-Institut für Polymerforschung, Ackermannweg 10, 55128 Mainz, Germany

  4. 6

    Forschungszentrum Karlsruhe, Postfach 3640, 76201 Karlsruhe, Germany

  5. 7

    Institut für Mechanik, Otto-von-Guericke-Universität Magdeburg, Universitätsplatz 2, 39160 Magdeburg, Germany

Author Information

  1. 1

    Chemnitzer Werkstoffmechanik GmbH, Chemnitz, Germany

  2. 2

    Fraunhofer Institute for Reliability and Microintegration, Berlin, Germany

Publication History

  1. Published Online: 27 APR 2006
  2. Published Print: 27 JUN 2000

Book Series:

  1. EUROMAT 99

ISBN Information

Print ISBN: 9783527302543

Online ISBN: 9783527607426

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Keywords:

  • functional materials;
  • interface cracking in electronic packages;
  • crack initiation;
  • crack propagation;
  • investigation

Summary

The investigations of local displacements and displacement fields by optical methods in combination with Finite Element Analysis lead to a better understanding of crack initiation and crack propagation and consequently to detailed knowledge about package stability.