Microlaminography for High-Resolution BGA and Flip-Chip Inspection

  1. Dr. K. Grassie2,
  2. Prof. Dr. E. Teuckhoff3,
  3. Prof. Dr. G. Wegner4,
  4. Prof. Dr. J. Hausselt5 and
  5. Prof. Dr. H. Hanselka6
  1. Alexander Sassov and
  2. Filip Luypaert

Published Online: 27 APR 2006

DOI: 10.1002/3527607420.ch15

Functional Materials, Volume 13

Functional Materials, Volume 13

How to Cite

Sassov, A. and Luypaert, F. (2000) Microlaminography for High-Resolution BGA and Flip-Chip Inspection, in Functional Materials, Volume 13 (eds K. Grassie, E. Teuckhoff, G. Wegner, J. Hausselt and H. Hanselka), Wiley-VCH Verlag GmbH & Co. KGaA, Weinheim, FRG. doi: 10.1002/3527607420.ch15

Editor Information

  1. 2

    Philips Forschungslaboratorium, Postfach 500145, 52085 Aachen, Germany

  2. 3

    Siemens AG, Postfach 3240, 91050 Erlangen, Germany

  3. 4

    Max-Planck-Institut für Polymerforschung, Ackermannweg 10, 55128 Mainz, Germany

  4. 5

    Forschungszentrum Karlsruhe, Postfach 3640, 76201 Karlsruhe, Germany

  5. 6

    Institut für Mechanik, Otto-von-Guericke-Universität Magdeburg, Universitätsplatz 2, 39160 Magdeburg, Germany

Author Information

  1. SkyScan, Aartselaar, Belgium

Publication History

  1. Published Online: 27 APR 2006
  2. Published Print: 27 JUN 2000

Book Series:

  1. EUROMAT 99

ISBN Information

Print ISBN: 9783527302543

Online ISBN: 9783527607426



  • functional materials;
  • microlaminography;
  • high-resolution BGA;
  • flip-chip inspection


New approach in digital microlaminography was used for high-resolution layer-by-layer separation of internal microstructure in any place of the big planar objects (multilayers, PCBs etc.), which cannot be reconstructed by computerized tomography because of limited possibilities in rotation. Depth and lateral spatial resolutions in the micron range can be reached. Microfocus X-ray sources and digital acquisition techniques with nonrotatable cameras allow improving performances.