Electroless Metal Deposition Used as Underbump Metallization (UBM) for High Temperature Application - a Comparison to Other Bumping Techniques

  1. Dr. K. Grassie3,
  2. Prof. Dr. E. Teuckhoff4,
  3. Prof. Dr. G. Wegner5,
  4. Prof. Dr. J. Hausselt6 and
  5. Prof. Dr. H. Hanselka7
  1. Sabine Anhöck1,
  2. Andreas Ostmann1,
  3. Hermann Oppermann1,
  4. Rolf Aschenbrenner2 and
  5. Herbert Reichl2

Published Online: 27 APR 2006

DOI: 10.1002/3527607420.ch8

Functional Materials, Volume 13

Functional Materials, Volume 13

How to Cite

Anhöck, S., Ostmann, A., Oppermann, H., Aschenbrenner, R. and Reichl, H. (2000) Electroless Metal Deposition Used as Underbump Metallization (UBM) for High Temperature Application - a Comparison to Other Bumping Techniques, in Functional Materials, Volume 13 (eds K. Grassie, E. Teuckhoff, G. Wegner, J. Hausselt and H. Hanselka), Wiley-VCH Verlag GmbH & Co. KGaA, Weinheim, FRG. doi: 10.1002/3527607420.ch8

Editor Information

  1. 3

    Philips Forschungslaboratorium, Postfach 500145, 52085 Aachen, Germany

  2. 4

    Siemens AG, Postfach 3240, 91050 Erlangen, Germany

  3. 5

    Max-Planck-Institut für Polymerforschung, Ackermannweg 10, 55128 Mainz, Germany

  4. 6

    Forschungszentrum Karlsruhe, Postfach 3640, 76201 Karlsruhe, Germany

  5. 7

    Institut für Mechanik, Otto-von-Guericke-Universität Magdeburg, Universitätsplatz 2, 39160 Magdeburg, Germany

Author Information

  1. 1

    Technical University of Berlin, Center of Microperipherik, TIB 4/2-1, Gustav-Meyer-Allee 25, D-13355 Berlin, Germany

  2. 2

    Fraunhofer Institute for Reliability and Microintegration, Gustav-Meyer-Allee 25, D-13355 Berlin, Germany

Publication History

  1. Published Online: 27 APR 2006
  2. Published Print: 27 JUN 2000

Book Series:

  1. EUROMAT 99

ISBN Information

Print ISBN: 9783527302543

Online ISBN: 9783527607426

SEARCH

Keywords:

  • functional materials;
  • electroless metal deposition;
  • underbump metallization (UBM);
  • high temperature application

Summary

The focus of the paper is to summarize the results from aging of AuSn20 solder preforms on different metallizations such as Cu, Cr, Ni, Pd and Pt to find a suitable metallization for high temperature application. Furthermore the reaction of PbSn63 solder preforms on different Ni metallizations such as electroless deposited Ni, electroplated Ni and pure Ni bulk metallization will be discussed. Differences in the phases growth due to the electroless deposition will be described.