Chapter 8. Reel-to-reel Vacuum Metallization

  1. Dr. Hagen Klauk
  1. Roland Treutlein1,
  2. Martin Bergsmann2,
  3. Carl J. Stonley3

Published Online: 28 AUG 2006

DOI: 10.1002/3527608753.ch8

Organic Electronics: Materials, Manufacturing and Applications

Organic Electronics: Materials, Manufacturing and Applications

How to Cite

Treutlein, R., Bergsmann, M. and Stonley, C. J. (2006) Reel-to-reel Vacuum Metallization, in Organic Electronics: Materials, Manufacturing and Applications (ed H. Klauk), Wiley-VCH Verlag GmbH & Co. KGaA, Weinheim, FRG. doi: 10.1002/3527608753.ch8

Editor Information

  1. Max Planck Institute for Solid State Research, Heisenbergstr. 1, 70569 Stuttgart, Germany

Author Information

  1. 1

    Hueck Folien GmbH & Co. KG, PO Box 1758, 92607 Weiden, Germany

  2. 2

    Hueck Folien GmbH, Gewerbepark 30, 4342 Baumgartenberg, Austria

  3. 3

    18 St. Leonards Drive, Wollaton, Nottingham, NG8 2BB, UK

Publication History

  1. Published Online: 28 AUG 2006
  2. Published Print: 22 MAY 2006

ISBN Information

Print ISBN: 9783527312641

Online ISBN: 9783527608751

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Keywords:

  • organic electronics;
  • manufacturing;
  • reel-to-reel vacuum metallization;
  • metallization process;
  • properties of the evaporated layer;
  • environmental benefits of vacuum evaporated layers;
  • applications of metallized films;
  • market analysis

Summary

This chapter contains sections titled:

  • Reel-to-reel Vacuum Metallization

    • The Metallization Process

      • Evaporation Sources

      • Pretreatment and Cleaning of the Web Substrate

      • PVD Process Flow

      • Typical Process Times, Rates, and Quantities

      • Transfer Metallization

      • Pattern-evaporated Layers

    • Properties of the Evaporated Layer

      • Structure

      • Layer Thickness (Conductivity)

      • Barrier

      • Light Barrier

    • Environmental Benefits of Vacuum Evaporated Layers

    • Applications of Metallized Films

      • Barrier Packaging

      • Decorative Applications

      • Functional Layers

      • Polymer Electronic Substrates

    • Market Analysis

  • References