5. Lead-Free Assembly Reliability—General

  1. Edwin Bradley1,
  2. Carol A. Handwerker2,
  3. Jasbir Bath3,
  4. Richard D. Parker4 and
  5. Ronald W. Gedney
  1. Edwin Bradley

Published Online: 1 MAR 2007

DOI: 10.1002/9780470171479.ch5

Lead-Free Electronics: iNEMI Projects Lead to Successful Manufacturing

Lead-Free Electronics: iNEMI Projects Lead to Successful Manufacturing

How to Cite

Bradley, E. (2007) Lead-Free Assembly Reliability—General, in Lead-Free Electronics: iNEMI Projects Lead to Successful Manufacturing (eds E. Bradley, C. A. Handwerker, J. Bath, R. D. Parker and R. W. Gedney), John Wiley & Sons, Inc., Hoboken, NJ, USA. doi: 10.1002/9780470171479.ch5

Editor Information

  1. 1

    Motorola, Plantation, Florida, USA

  2. 2

    Purdue University, West Lafayette, Indiana, USA

  3. 3

    Solectron Corporation, Milpetas, California, USA

  4. 4

    Delphi Electronics & Safety, Kokomo, Indiana, USA

Author Information

  1. Motorola, Plantation, Florida, USA

Publication History

  1. Published Online: 1 MAR 2007
  2. Published Print: 21 SEP 2007

ISBN Information

Print ISBN: 9780471448877

Online ISBN: 9780470171479

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Keywords:

  • lead-free assembly reliability;
  • thermal fatigue in tin–lead and lead-free solders;
  • creep deformation and creep rupture

Summary

This chapter contains sections titled:

  • Introduction

  • Basic Physical Properties of Solder

  • Creep Deformation

  • Thermal Fatigue

  • Creep Rupture

  • Isothermal (Mechanical) Fatigue

  • Out-of-Plane Bending

  • Impact/Shock Loading

  • Effect of Rework on Reliability

  • High-Temperature Operating Life (HTOL)

  • Electrochemical Migration

  • Tin Whiskering

  • Tin Pest

  • Summary

  • Acknowledgments

  • References