39. Materials in Electronic Packaging

  1. Myer Kutz
  1. Warren C. Fackler

Published Online: 8 NOV 2007

DOI: 10.1002/9780470172551.ch39

Handbook of Materials Selection

Handbook of Materials Selection

How to Cite

Fackler, W. C. (2002) Materials in Electronic Packaging, in Handbook of Materials Selection (ed M. Kutz), John Wiley & Sons, Inc., New York. doi: 10.1002/9780470172551.ch39

Editor Information

  1. Myer Kutz Associates, Inc., Albany, NY, USA

Author Information

  1. Telesis Systems, Cedar Rapids, Iowa, USA

Publication History

  1. Published Online: 8 NOV 2007
  2. Published Print: 12 JUL 2002

ISBN Information

Print ISBN: 9780471359241

Online ISBN: 9780470172551

SEARCH

Keywords:

  • heat sink material;
  • thermally insulating film;
  • position-sensitive assemblies;
  • materials environmental endurance;
  • categories of materials

Summary

This chapter contains sections titled:

  • General

  • Approach

  • Dominant Considerations

  • Overriding Considerations

  • Typical Applications

  • Candidate Materials

  • Summary

  • References