11. Planarization Technologies Involving Electrochemical Reactions

  1. Yuzhuo Li
  1. Laertis Economikos

Published Online: 23 MAR 2007

DOI: 10.1002/9780470180907.ch11

Microelectronic Applications of Chemical Mechanical Planarization

Microelectronic Applications of Chemical Mechanical Planarization

How to Cite

Economikos, L. (2007) Planarization Technologies Involving Electrochemical Reactions, in Microelectronic Applications of Chemical Mechanical Planarization (ed Y. Li), John Wiley & Sons, Inc., Hoboken, NJ, USA. doi: 10.1002/9780470180907.ch11

Editor Information

  1. Center for Advanced Materials Processing, Department of Chemistry, Clarkson University, 8 Clarkson Avenue, Potsdam, NY 13699, USA

Author Information

  1. IBM Systems and Technology Group, Semiconductor Research & Development Center, Hopewell Junction, NY 12533, USA

Publication History

  1. Published Online: 23 MAR 2007
  2. Published Print: 5 OCT 2007

ISBN Information

Print ISBN: 9780471719199

Online ISBN: 9780470180907

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Keywords:

  • voltage-activated electrochemical reactions;
  • diffusion layer thickness;
  • eddy-current-based metrology unit

Summary

This chapter contains sections titled:

  • Introduction

  • CMP

  • ECP

  • ECMP

  • Full Sequence Electrochemical–Mechanical Planarization

  • Conclusions

  • Acknowledgments

  • Questions

  • References