15. Three-Dimensional (3D) Integration

  1. Yuzhuo Li
  1. J. Jay McMahon1,
  2. Jian-Qiang Lu1 and
  3. Ronald J. Gutmann2

Published Online: 23 MAR 2007

DOI: 10.1002/9780470180907.ch15

Microelectronic Applications of Chemical Mechanical Planarization

Microelectronic Applications of Chemical Mechanical Planarization

How to Cite

McMahon, J. J., Lu, J.-Q. and Gutmann, R. J. (2007) Three-Dimensional (3D) Integration, in Microelectronic Applications of Chemical Mechanical Planarization (ed Y. Li), John Wiley & Sons, Inc., Hoboken, NJ, USA. doi: 10.1002/9780470180907.ch15

Editor Information

  1. Center for Advanced Materials Processing, Department of Chemistry, Clarkson University, 8 Clarkson Avenue, Potsdam, NY 13699, USA

Author Information

  1. 1

    Center for Integrated Electronics, Rensselaer Polytechnic Institute, CII 6015, 110 8th St, Troy, NY 12180, USA

  2. 2

    Professor Emeritus, Rensselaer Polytechnic Institute, CII 6015, 110 8th St, Troy, NY 12180, USA

Publication History

  1. Published Online: 23 MAR 2007
  2. Published Print: 5 OCT 2007

ISBN Information

Print ISBN: 9780471719199

Online ISBN: 9780470180907

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Keywords:

  • wafer-level processing;
  • deep-submicron alignment and nanoimprint lithography;
  • face-to-face and face-to-back bonding

Summary

This chapter contains sections titled:

  • Overview of 3D Technology

  • Factors Motivating Research in 3D

  • Approaches to 3D

  • Wafer-Level 3D Unit Processes

  • Planarity Issues in 3D Integration

  • Conclusions

  • Questions

  • References