18. CMP Slurry Metrology, Distribution, and Filtration

  1. Yuzhuo Li
  1. Rakesh K. Singh

Published Online: 23 MAR 2007

DOI: 10.1002/9780470180907.ch18

Microelectronic Applications of Chemical Mechanical Planarization

Microelectronic Applications of Chemical Mechanical Planarization

How to Cite

Singh, R. K. (2007) CMP Slurry Metrology, Distribution, and Filtration, in Microelectronic Applications of Chemical Mechanical Planarization (ed Y. Li), John Wiley & Sons, Inc., Hoboken, NJ, USA. doi: 10.1002/9780470180907.ch18

Editor Information

  1. Center for Advanced Materials Processing, Department of Chemistry, Clarkson University, 8 Clarkson Avenue, Potsdam, NY 13699, USA

Author Information

  1. Liquid Microcontamination Control, Entegris, Inc., 129 Concord Road, Bldg. 2, Billerica, MA 01821, USA

Publication History

  1. Published Online: 23 MAR 2007
  2. Published Print: 5 OCT 2007

ISBN Information

Print ISBN: 9780471719199

Online ISBN: 9780470180907

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Keywords:

  • metal dielectric slurries;
  • defect-causing large particles;
  • slurry handling and filtration

Summary

This chapter contains sections titled:

  • Introduction

  • CMP Slurry Metrology and Characterization

  • CMP Slurry Blending and Distribution

  • CMP Slurry Filtration

  • Pump Handling Effects on CMP Slurry Filtration—Case Studies

  • Acknowledgments

  • Questions

  • References