2. Current and Future Challenges in CMP Materials

  1. Yuzhuo Li
  1. Mansour Moinpour

Published Online: 23 MAR 2007

DOI: 10.1002/9780470180907.ch2

Microelectronic Applications of Chemical Mechanical Planarization

Microelectronic Applications of Chemical Mechanical Planarization

How to Cite

Moinpour, M. (2007) Current and Future Challenges in CMP Materials, in Microelectronic Applications of Chemical Mechanical Planarization (ed Y. Li), John Wiley & Sons, Inc., Hoboken, NJ, USA. doi: 10.1002/9780470180907.ch2

Editor Information

  1. Center for Advanced Materials Processing, Department of Chemistry, Clarkson University, 8 Clarkson Avenue, Potsdam, NY 13699, USA

Author Information

  1. Intel Corporation, 2200 Mission College Blvd, Mail Stop SC3-06, Santa Clara, CA 95054, USA

Publication History

  1. Published Online: 23 MAR 2007
  2. Published Print: 5 OCT 2007

ISBN Information

Print ISBN: 9780471719199

Online ISBN: 9780470180907

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Keywords:

  • integrated circuits fabrication technology;
  • steady-state rheometric test;
  • slurry film thickness

Summary

This chapter contains sections titled:

  • Introduction

  • Historic Prospective and Future Trends

  • CMP Material Characterization

  • Conclusions

  • Acknowledgment

  • Questions

  • References