3. Processing Tools for Manufacturing

  1. Yuzhuo Li
  1. Manabu Tsujimura

Published Online: 23 MAR 2007

DOI: 10.1002/9780470180907.ch3

Microelectronic Applications of Chemical Mechanical Planarization

Microelectronic Applications of Chemical Mechanical Planarization

How to Cite

Tsujimura, M. (2007) Processing Tools for Manufacturing, in Microelectronic Applications of Chemical Mechanical Planarization (ed Y. Li), John Wiley & Sons, Inc., Hoboken, NJ, USA. doi: 10.1002/9780470180907.ch3

Editor Information

  1. Center for Advanced Materials Processing, Department of Chemistry, Clarkson University, 8 Clarkson Avenue, Potsdam, NY 13699, USA

Author Information

  1. Ebara Corporation, 4-2-1 Honfujisawa, Fujisawa-shi 251-8502, Japan

Publication History

  1. Published Online: 23 MAR 2007
  2. Published Print: 5 OCT 2007

ISBN Information

Print ISBN: 9780471719199

Online ISBN: 9780470180907

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Keywords:

  • chemical–mechanical planarization;
  • polished wafers nanotopography;
  • shallow trench isolation

Summary

This chapter contains sections titled:

  • CMP Operation and Characteristics

  • Description of the CMP Process

  • Overview of Polishers

  • Carriers and Dressers

  • In Situ and Ex Situ Metrologies

  • Conclusions

  • Questions

  • References