4. Tribometrology of CMP Process

  1. Yuzhuo Li
  1. Norm Gitis and
  2. Raghu Mudhivarthi

Published Online: 23 MAR 2007

DOI: 10.1002/9780470180907.ch4

Microelectronic Applications of Chemical Mechanical Planarization

Microelectronic Applications of Chemical Mechanical Planarization

How to Cite

Gitis, N. and Mudhivarthi, R. (2007) Tribometrology of CMP Process, in Microelectronic Applications of Chemical Mechanical Planarization (ed Y. Li), John Wiley & Sons, Inc., Hoboken, NJ, USA. doi: 10.1002/9780470180907.ch4

Editor Information

  1. Center for Advanced Materials Processing, Department of Chemistry, Clarkson University, 8 Clarkson Avenue, Potsdam, NY 13699, USA

Author Information

  1. Center for Tribology, Inc., 1715 Dell Ave., Campbell, CA 95008, USA

Publication History

  1. Published Online: 23 MAR 2007
  2. Published Print: 5 OCT 2007

ISBN Information

Print ISBN: 9780471719199

Online ISBN: 9780470180907

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Keywords:

  • wafer–pad and conditioner–pad interface;
  • hydrostatic and elastohydrodynamic lubrication regimes;
  • wafer removal rate and within-wafer non-uniformity

Summary

This chapter contains sections titled:

  • Introduction

  • Tribometrology of CMP

  • Factors Influencing the Tribology During CMP

  • Optimizing Pad Conditioning Process

  • Conditioner Design

  • CMP Consumable Testing

  • Defect Analysis

  • Summary

  • Questions

  • References