5. Pads for IC CMP

  1. Yuzhuo Li
  1. Changxue Wang1,
  2. Ed Paul2,
  3. Toshihiro Kobayashi3 and
  4. Yuzhuo Li4

Published Online: 23 MAR 2007

DOI: 10.1002/9780470180907.ch5

Microelectronic Applications of Chemical Mechanical Planarization

Microelectronic Applications of Chemical Mechanical Planarization

How to Cite

Wang, C., Paul, E., Kobayashi, T. and Li, Y. (2007) Pads for IC CMP, in Microelectronic Applications of Chemical Mechanical Planarization (ed Y. Li), John Wiley & Sons, Inc., Hoboken, NJ, USA. doi: 10.1002/9780470180907.ch5

Editor Information

  1. Center for Advanced Materials Processing, Department of Chemistry, Clarkson University, 8 Clarkson Avenue, Potsdam, NY 13699, USA

Author Information

  1. 1

    Center for Advanced Materials Processing, Clarkson University, 8 Clarkson Avenue, Potsdam, NY 13699, USA

  2. 2

    Department of Chemistry, Stockton College, Pomona, NJ 08240, USA

  3. 3

    Mipox International Corporation, 25821 Industrial Blvd., Suite 200, Hayward, CA 94545, USA

  4. 4

    Center for Advanced Materials Processing, Department of Chemistry, Clarkson University, 8 Clarkson Avenue, Potsdam, NY 13699, USA

Publication History

  1. Published Online: 23 MAR 2007
  2. Published Print: 5 OCT 2007

ISBN Information

Print ISBN: 9780471719199

Online ISBN: 9780470180907

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Keywords:

  • pad microstructures and macrostructures;
  • planarization and polishing uniformity;
  • pad surface roughness parameters

Summary

This chapter contains sections titled:

  • Introduction

  • Physical Properties of CMP Pads and Their Effects on Polishing Performance

  • Chemical Properties of CMP Pads and Their Effects on Polishing Performances

  • Pad Conditioning and Its Effect on CMP Performance

  • Modeling of Pad Effects on Polishing Performance

  • Novel Designs of CMP Pads

  • Questions

  • References