6. Modeling

  1. Yuzhuo Li
  1. Leonard Borucki1 and
  2. Ara Philipossian2

Published Online: 23 MAR 2007

DOI: 10.1002/9780470180907.ch6

Microelectronic Applications of Chemical Mechanical Planarization

Microelectronic Applications of Chemical Mechanical Planarization

How to Cite

Borucki, L. and Philipossian, A. (2007) Modeling, in Microelectronic Applications of Chemical Mechanical Planarization (ed Y. Li), John Wiley & Sons, Inc., Hoboken, NJ, USA. doi: 10.1002/9780470180907.ch6

Editor Information

  1. Center for Advanced Materials Processing, Department of Chemistry, Clarkson University, 8 Clarkson Avenue, Potsdam, NY 13699, USA

Author Information

  1. 1

    3831 E. Ivy Street, Mesa, AZ 85205, USA

  2. 2

    Department of Chemical and Environmental Engineering, University of Arizona, PO Box 210011, Tuscan, AZ 85721, USA

Publication History

  1. Published Online: 23 MAR 2007
  2. Published Print: 5 OCT 2007

ISBN Information

Print ISBN: 9780471719199

Online ISBN: 9780470180907

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Keywords:

  • elastohydrodynamic lubrication;
  • mean pad leading edge temperature;
  • roughness-dominated and asperity filtering regimes

Summary

This chapter contains sections titled:

  • Introduction

  • A Two-Step Chemical Mechanical Material Removal Model

  • Pad Surfaces and Pad Surface Contact Modeling

  • Reaction Temperature

  • A Polishing Example

  • Topography Planarization

  • Questions

  • References