9. Tungsten CMP Applications

  1. Yuzhuo Li
  1. Jeff Visser

Published Online: 23 MAR 2007

DOI: 10.1002/9780470180907.ch9

Microelectronic Applications of Chemical Mechanical Planarization

Microelectronic Applications of Chemical Mechanical Planarization

How to Cite

Visser, J. (2007) Tungsten CMP Applications, in Microelectronic Applications of Chemical Mechanical Planarization (ed Y. Li), John Wiley & Sons, Inc., Hoboken, NJ, USA. doi: 10.1002/9780470180907.ch9

Editor Information

  1. Center for Advanced Materials Processing, Department of Chemistry, Clarkson University, 8 Clarkson Avenue, Potsdam, NY 13699, USA

Author Information

  1. ATDF, 2706 Montopolis Drive, Austin, Texas 78741, USA

Publication History

  1. Published Online: 23 MAR 2007
  2. Published Print: 5 OCT 2007

ISBN Information

Print ISBN: 9780471719199

Online ISBN: 9780470180907

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Keywords:

  • chatter marks and macroscratches;
  • chemical vapor deposition;
  • within-wafer nonuniformity

Summary

This chapter contains sections titled:

  • Introduction

  • Basic Tungsten Application, Requirements, and Process

  • W CMP Defects

  • Various W CMP Processing Options

  • Overall Tungsten Process (Various Processing Design Options and Suggestions)

  • Conclusions

  • Questions

  • References