36. Optimization of Adhesion Condition of Resin Board and Copper Plate

  1. Dr. Genichi Taguchi engineering Executive Director Honorary Member,
  2. Dr. Subir Chowdhury aerospace engineering, industrial management chairman CEO world leader strategist author honorary member honorary doctorate and
  3. Yuin Wu B.S. in chemical engineering professor Executive Director consultant

Published Online: 26 NOV 2007

DOI: 10.1002/9780470258354.cs36

Taguchi's Quality Engineering Handbook

Taguchi's Quality Engineering Handbook

How to Cite

Taguchi, G., Chowdhury, S. and Wu, Y. (2004) Optimization of Adhesion Condition of Resin Board and Copper Plate, in Taguchi's Quality Engineering Handbook, John Wiley & Sons, Inc., Hoboken, NJ, USA. doi: 10.1002/9780470258354.cs36

Author Information

  1. American Supplier Institute (ASI), USA

Publication History

  1. Published Online: 26 NOV 2007
  2. Published Print: 22 OCT 2004

ISBN Information

Print ISBN: 9780471413349

Online ISBN: 9780470258354

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Keywords:

  • optimization of adhesion condition - resin board and copper plate;
  • SN ratio and sensitivity calculations;
  • cost/benefit ratio from functionality optimization;
  • copper plate as heat radiator

Summary

This chapter contains sections titled:

  • Introduction

  • Generic Function

  • SN Ratio

  • Optimization Configuration and Results of Confirmatory Experiment

  • Reference