Chapter 10. Cermet-Bonded Metal Pins for Weldable Electrical Feedthroughs in Alumina

  1. William J. Smothers
  1. M. D. Kelly

Published Online: 26 MAR 2008

DOI: 10.1002/9780470291092.ch10

Proceedings of the 5th Annual Conference on Composites and Advanced Ceramic Materials: Ceramic Engineering and Science Proceedings, Volume 2, Issue 7/8

Proceedings of the 5th Annual Conference on Composites and Advanced Ceramic Materials: Ceramic Engineering and Science Proceedings, Volume 2, Issue 7/8

How to Cite

Kelly, M. D. (1981) Cermet-Bonded Metal Pins for Weldable Electrical Feedthroughs in Alumina, in Proceedings of the 5th Annual Conference on Composites and Advanced Ceramic Materials: Ceramic Engineering and Science Proceedings, Volume 2, Issue 7/8 (ed W. J. Smothers), John Wiley & Sons, Inc., Hoboken, NJ, USA. doi: 10.1002/9780470291092.ch10

Author Information

  1. Mound Facility, Miamisburg, Ohio 45342

Publication History

  1. Published Online: 26 MAR 2008
  2. Published Print: 1 JAN 1981

ISBN Information

Print ISBN: 9780470373903

Online ISBN: 9780470291092

SEARCH

Keywords:

  • molybdenum;
  • atmosphere;
  • hydrogen;
  • microprobe;
  • electron

Summary

In several applications Mo/Al2O3, cermets are used for providing electrical feedthroughs in alumina substrates. An engineering technique to insert metal pins through the alumina body, while maintaining the benefits of the cermet, was developed. In this two-step process, metal tubes (molybdenum) are inserted into holes drilled in a green Mo/Al2O3, cermet and sintered in place. Then copper or Kovar metal pins are diffusion bonded in these tubes. The metal pins form electrical feedthroughs, which are more conductive, stronger, and require fewer processing steps than the present methods of using cermet feedthroughs.