Chapter 87. Metallic Bonding of Ceramic Armor Using Reactive Multilayer Foils

  1. Edgar Lara-Curzio and
  2. Michael J. Readey
  1. A. Duckham,
  2. M. Brown,
  3. E. Besnoin,
  4. D. Van Heerden,
  5. O. M. Knio and
  6. T. P. Weihs

Published Online: 26 MAR 2008

DOI: 10.1002/9780470291184.ch87

28th International Conference on Advanced Ceramics and Composites A: Ceramic Engineering and Science Proceedings, Volume 25, Issue 3

28th International Conference on Advanced Ceramics and Composites A: Ceramic Engineering and Science Proceedings, Volume 25, Issue 3

How to Cite

Duckham, A., Brown, M., Besnoin, E., Van Heerden, D., Knio, O. M. and Weihs, T. P. (2004) Metallic Bonding of Ceramic Armor Using Reactive Multilayer Foils, in 28th International Conference on Advanced Ceramics and Composites A: Ceramic Engineering and Science Proceedings, Volume 25, Issue 3 (eds E. Lara-Curzio and M. J. Readey), John Wiley & Sons, Inc., Hoboken, NJ, USA. doi: 10.1002/9780470291184.ch87

Author Information

  1. Reactive Nano Technologies 111 Lake Front Drive Hunt Valley, MD 21030

Publication History

  1. Published Online: 26 MAR 2008
  2. Published Print: 1 JAN 2004

ISBN Information

Print ISBN: 9780470051498

Online ISBN: 9780470291184

SEARCH

Keywords:

  • CTE;
  • IR;
  • DAAD;
  • SIC;
  • titanium system

Summary

The room temperature brazing and soldering of ceramic armor to metallic plates is described. the novel metallic bonding process uses reactive multilayer foils (NanoFoil™) as local heat sources to melt braze or solder layers placed between the ceramic and metal components. by replacing furnace cycles with local heating this NanoBond™ process eliminates significant heating of the components and thus large area components can be bonded relatively stress-free. Examples of bonding Al2O3 to aluminum and of bonding SiC to titanium are presented and several configurations involving different braze and solder layers have been investigated in detail for the bonding of SiC to titanium. Shear strengths have been measured and are found to be significantly higher compared to those measured for similar samples bonded by epoxy adhesives. Numerical predictions of heat flow are also described for the reactive joining process and are validated by IR measurements. Lastly, bond areas over 100 cm2 are demonstrated.