12. Through-Thickness Properties of 2D Woven SiC/SiC Panels with Various Microstructures

  1. Edgar Lara-Curzio and
  2. Michael J. Readey
  1. H. M. Yun and
  2. J. A. Dicarlo

Published Online: 26 MAR 2008

DOI: 10.1002/9780470291191.ch12

28th International Conference on Advanced Ceramics and Composites B: Ceramic Engineering and Science Proceedings, Volume 25, Issue 4

28th International Conference on Advanced Ceramics and Composites B: Ceramic Engineering and Science Proceedings, Volume 25, Issue 4

How to Cite

Yun, H. M. and Dicarlo, J. A. (2004) Through-Thickness Properties of 2D Woven SiC/SiC Panels with Various Microstructures, in 28th International Conference on Advanced Ceramics and Composites B: Ceramic Engineering and Science Proceedings, Volume 25, Issue 4 (eds E. Lara-Curzio and M. J. Readey), John Wiley & Sons, Inc., Hoboken, NJ, USA. doi: 10.1002/9780470291191.ch12

Author Information

  1. NASA Glenn Research Center Cleveland, OH 44135

Publication History

  1. Published Online: 26 MAR 2008
  2. Published Print: 1 JAN 2004

ISBN Information

Print ISBN: 9780470051528

Online ISBN: 9780470291191

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Keywords:

  • ceramic matrix composites;
  • thermal gradients;
  • thermal conductivity;
  • interlaminar tensile;
  • fiber fraction system

Summary

CMC hot-section components in advanced aero and space propulsion systems will typically require high mechanical performance (cracking strength, ultimate strength and strain, and creep-rupture resistance) for all directions in which the component will experience significant service-related stresses. In addition, the CMC should display high through-thickness thermal conductivity and be fabricated in thin sections in order to reduce stresses due to through-thickness thermal gradients. Thus CMC component microstructures, fiber architectures, and wall thicknesses need to be optimized to maximize these properties. The objective of this study was to measure, as a function of temperature, the effects of different microstructures and fiber architectures on the in-plane stress-strain behavior, thru-thickness tensile strength, and thermal conductivity of thin SiC/BN/SiC composite panels. Key variables included fiber type, fiber volume fraction, fiber architectures, BN interphase volume fraction, fiber-interphase-matrix bonding, matrix type, matrix composition, and matrix porosity. Fiber architectures primarily included those formed from random 2D fabric lay-up. The matrix types evaluated were partial CVI SIC plus slurry-cast MI SiC/Si, full PIP SiC, and full CVI SiC. The property results are interpreted in terms of underlying mechanisms. Approaches for optimizing the through-thickness behavior of SiC/SiC CMC are discussed.