18. Determination of Elastic Moduli and Poisson Coefficient of Thin Silicon-Based Joint Using Digital Image Correlation

  1. Edgar Lara-Curzio
  1. Matthieu Puyo-Pain1,
  2. Jacques Lamon1 and
  3. François Hild2

Published Online: 26 MAR 2008

DOI: 10.1002/9780470291221.ch18

Mechanical Properties and Performance of Engineering Ceramics and Composites: Ceramic Engineering and Science Proceedings, Volume 26, Number 2

Mechanical Properties and Performance of Engineering Ceramics and Composites: Ceramic Engineering and Science Proceedings, Volume 26, Number 2

How to Cite

Puyo-Pain, M., Lamon, J. and Hild, F. (2005) Determination of Elastic Moduli and Poisson Coefficient of Thin Silicon-Based Joint Using Digital Image Correlation, in Mechanical Properties and Performance of Engineering Ceramics and Composites: Ceramic Engineering and Science Proceedings, Volume 26, Number 2 (ed E. Lara-Curzio), John Wiley & Sons, Inc., Hoboken, NJ, USA. doi: 10.1002/9780470291221.ch18

Author Information

  1. 1

    Laboratoire des Composites Thermostructuraux (LCTS) UMR 5801 CNRS/Snecma/CEA/Université Bordeaux 1 3 Allée de La Boëtie F-33600 Pessac, France

  2. 2

    Laboratoire de Mécanique et Technologie (LMT-Cachan) ENS Cachan/CNRS-UMR 8535/Université Paris 6 61 avenue du Président Wilson F-94235 Cachan Cedex, France

Publication History

  1. Published Online: 26 MAR 2008
  2. Published Print: 1 JAN 2005

ISBN Information

Print ISBN: 9781574982329

Online ISBN: 9780470291221

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Keywords:

  • optical extensomehy;
  • digital image correlation technique;
  • elastic constants;
  • off-axis compression;
  • nanoindentation

Summary

Optical extensometry based on a digital image correlation technique (DIC) is an interesting approach to the determination of displacements and strains in thin joints. The test specimens consisted of two monolithic SiC bars assembled by using a silicon-based braze (BraSiC). They were tested in four-point bending. Elastic properties of BraSiC are extracted from joint strain state measured by using DIC and computed using finite element analysis. They are compared to results of tensile, off-axis compression and nanoindentation tests carried out on similar samples.