40. Transpiration Cooling Structure Effects on the Strength of 3D-Woven SiC/SiC Composites Under Thermal Cycling

  1. Edgar Lara-Curzio
  1. Toshimitsu Hayashi

Published Online: 26 MAR 2008

DOI: 10.1002/9780470291221.ch40

Mechanical Properties and Performance of Engineering Ceramics and Composites: Ceramic Engineering and Science Proceedings, Volume 26, Number 2

Mechanical Properties and Performance of Engineering Ceramics and Composites: Ceramic Engineering and Science Proceedings, Volume 26, Number 2

How to Cite

Hayashi, T. (2005) Transpiration Cooling Structure Effects on the Strength of 3D-Woven SiC/SiC Composites Under Thermal Cycling, in Mechanical Properties and Performance of Engineering Ceramics and Composites: Ceramic Engineering and Science Proceedings, Volume 26, Number 2 (ed E. Lara-Curzio), John Wiley & Sons, Inc., Hoboken, NJ, USA. doi: 10.1002/9780470291221.ch40

Author Information

  1. 3rd Research Center, Technical Research & Development Institute, Japan Defense Agency 1-2-10 Sakae, Tachikawa, Tokyo, 190-8533, JAPAN

Publication History

  1. Published Online: 26 MAR 2008
  2. Published Print: 1 JAN 2005

ISBN Information

Print ISBN: 9781574982329

Online ISBN: 9780470291221

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Keywords:

  • thermal cycling;
  • ceramics matrix composite;
  • chain stitching;
  • burner rig test;
  • thermal conductivity

Summary

Evaluation of strength degradation under thermal cycling conditions is an important issue for applying the CMC to hot section parts of gas turbine engines. In this study, the strength degradation of the 3D-woven CMC (SiC/SiC) with and without the transpiration cooling structure was investigated in a burner rig test Each specimen was subjected to the test for 200 thermal cycles with the same heating (from the front side of the specimen) and cooling (from the back side of the specimen) conditions. Four-point bending strength before and after the burner rig test results indicated that the transpiration cooling structure was effective in reducing the strength degradation of the CMC under thermal cycling conditions.