30. Enhanced Wettability by Copper Electroless Coating of Carbon Nanotubes

  1. Dongming Zhu and
  2. Kevin Plucknett
  1. Camille Probst,
  2. Céline Goujon,
  3. Raynald Gauvin and
  4. Robin A. L. Drew

Published Online: 26 MAR 2008

DOI: 10.1002/9780470291238.ch30

Advances in Ceramic Coatings and Ceramic-Metal Systems: Ceramic Engineering and Science Proceedings, Volume 26, Number 3

Advances in Ceramic Coatings and Ceramic-Metal Systems: Ceramic Engineering and Science Proceedings, Volume 26, Number 3

How to Cite

Probst, C., Goujon, C., Gauvin, R. and Drew, R. A. L. (2005) Enhanced Wettability by Copper Electroless Coating of Carbon Nanotubes, in Advances in Ceramic Coatings and Ceramic-Metal Systems: Ceramic Engineering and Science Proceedings, Volume 26, Number 3 (eds D. Zhu and K. Plucknett), John Wiley & Sons, Inc., Hoboken, NJ, USA. doi: 10.1002/9780470291238.ch30

Author Information

  1. McGill University 3610 University Street Montreal, Quebec, H3A 2B2

Publication History

  1. Published Online: 26 MAR 2008
  2. Published Print: 1 JAN 2005

ISBN Information

Print ISBN: 9781574982336

Online ISBN: 9780470291238

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Keywords:

  • aluminum;
  • microscopy;
  • sepectroscopy;
  • palladium;
  • electroless

Summary

In recent years, carbon nanotubes have raised scientific interest due to their unmatched properties and their numerous potential applications. Their exceptional mechanical properties especially make them candidates for superstrong and lightweight nanocomposites. The present study aims to test the possibility of fabricating nanocomposites, with aluminum as the matrix and carbon nanotubes as the reinforcing phase, using liquid vacuum infiltration. Before infiltrating nanotubes by molten aluminum, it is necessary to enhance their wettability. For this purpose, an electroless plating of copper was carried out to ensure a good quality of the matrix / nanotubes interface. Three steps were needed to make this plating. Firstly, the carbon nanotubes were oxidized in a mixture of strong acids in order to improve their chemical reactivity. Secondly, their surface was activated by the deposition of some catalytic nuclei of palladium. Finally, the electroless copper-plating step was performed. Field Emission Scanning Electron Microscopy, Field Emission Transmission Electron Microscopy, Transmission Electron Microscopy, X-ray microanalysis, and Fourier-Transform Infra Red spectroscopy were used for chemical and microstructural characterization during the different steps of the process with emphasis on studying the interface.