11. Dielectric and Microstructural Properties of Ba(Ti1−xZrx)O3 Thin Films on Copper Substrates

  1. Sheng Yao,
  2. Bruce Tuttle,
  3. Clive Randall and
  4. Dwight Viehland
  1. J. F. Ihlefeld1,
  2. J-P. Maria1 and
  3. W. Borland2

Published Online: 26 MAR 2008

DOI: 10.1002/9780470291252.ch11

Advances in Electronic Ceramic Materials: Ceramic Engineering and Science Proceedings, Volume 26, Number 5

Advances in Electronic Ceramic Materials: Ceramic Engineering and Science Proceedings, Volume 26, Number 5

How to Cite

Ihlefeld, J. F., Maria, J.-P. and Borland, W. (2005) Dielectric and Microstructural Properties of Ba(Ti1−xZrx)O3 Thin Films on Copper Substrates, in Advances in Electronic Ceramic Materials: Ceramic Engineering and Science Proceedings, Volume 26, Number 5 (eds S. Yao, B. Tuttle, C. Randall and D. Viehland), John Wiley & Sons, Inc., Hoboken, NJ, USA. doi: 10.1002/9780470291252.ch11

Author Information

  1. 1

    Department of Materials Science and Engineering North Carolina State University Raleigh, North Carolina 27606

  2. 2

    DuPont Electronic Technologies Research Triangle Park, North Carolina 27709

Publication History

  1. Published Online: 26 MAR 2008
  2. Published Print: 1 JAN 2005

ISBN Information

Print ISBN: 9781574982350

Online ISBN: 9780470291252

SEARCH

Options for accessing this content:

  • If you have access to this content through a society membership, please first log in to your society website.
  • Login via other institutional login options http://onlinelibrary.wiley.com/login-options.
  • You can purchase online access to this Chapter for a 24-hour period (price varies by title)
    • If you already have a Wiley Online Library or Wiley InterScience user account: login above and proceed to purchase the article.
    • New Users: Please register, then proceed to purchase the article.

Login via OpenAthens

or

Search for your institution's name below to login via Shibboleth.

Please register to:

  • Save publications, articles and searches
  • Get email alerts
  • Get all the benefits mentioned below!

Register now >