13. High Q (Ba, Sr)TiO3 Interdigitated Capacitors Fabricated on Low Cost Polycrystalline Alumina Substrates with Copper Metallization
- Sheng Yao,
- Bruce Tuttle,
- Clive Randall and
- Dwight Viehland
Published Online: 26 MAR 2008
Copyright © 2005 The American Ceramic Society
Advances in Electronic Ceramic Materials: Ceramic Engineering and Science Proceedings, Volume 26, Number 5
How to Cite
Ghosh, D., Laughlin, B., Nath, J., Kingon, A. I., Steer, M. B. and Maria, J.-P. (2005) High Q (Ba, Sr)TiO3 Interdigitated Capacitors Fabricated on Low Cost Polycrystalline Alumina Substrates with Copper Metallization, in Advances in Electronic Ceramic Materials: Ceramic Engineering and Science Proceedings, Volume 26, Number 5 (eds S. Yao, B. Tuttle, C. Randall and D. Viehland), John Wiley & Sons, Inc., Hoboken, NJ, USA. doi: 10.1002/9780470291252.ch13
- Published Online: 26 MAR 2008
- Published Print: 1 JAN 2005
Print ISBN: 9781574982350
Online ISBN: 9780470291252
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