13. High Q (Ba, Sr)TiO3 Interdigitated Capacitors Fabricated on Low Cost Polycrystalline Alumina Substrates with Copper Metallization

  1. Sheng Yao,
  2. Bruce Tuttle,
  3. Clive Randall and
  4. Dwight Viehland
  1. Dipankar Ghosh1,
  2. B. Laughlin1,
  3. J. Nath2,
  4. A. I. Kingon1,
  5. M. B. Steer2 and
  6. J-P. Maria1

Published Online: 26 MAR 2008

DOI: 10.1002/9780470291252.ch13

Advances in Electronic Ceramic Materials: Ceramic Engineering and Science Proceedings, Volume 26, Number 5

Advances in Electronic Ceramic Materials: Ceramic Engineering and Science Proceedings, Volume 26, Number 5

How to Cite

Ghosh, D., Laughlin, B., Nath, J., Kingon, A. I., Steer, M. B. and Maria, J.-P. (2005) High Q (Ba, Sr)TiO3 Interdigitated Capacitors Fabricated on Low Cost Polycrystalline Alumina Substrates with Copper Metallization, in Advances in Electronic Ceramic Materials: Ceramic Engineering and Science Proceedings, Volume 26, Number 5 (eds S. Yao, B. Tuttle, C. Randall and D. Viehland), John Wiley & Sons, Inc., Hoboken, NJ, USA. doi: 10.1002/9780470291252.ch13

Author Information

  1. 1

    The Electroceramic Thin Film Group, Department of Materials Science and Engineering, North Carolina State University, Raleigh, NC 27695

  2. 2

    Electrical and Computer Engineering Department, North Carolina State University, Raleigh, NC 27695

Publication History

  1. Published Online: 26 MAR 2008
  2. Published Print: 1 JAN 2005

ISBN Information

Print ISBN: 9781574982350

Online ISBN: 9780470291252

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