29. 3D Fem Simulation of Mlcc Thermal Shock

  1. Manuel E. Brito,
  2. Peter Filip,
  3. Charles Lewinsohn,
  4. Ali Sayir,
  5. Mark Opeka and
  6. William M. Mullins
  1. Yang Ho Moon and
  2. Hyuk Joon Youn

Published Online: 26 MAR 2008

DOI: 10.1002/9780470291283.ch29

Developments in Advanced Ceramics and Composites: Ceramic Engineering and Science Proceedings, Volume 26, Number 8

Developments in Advanced Ceramics and Composites: Ceramic Engineering and Science Proceedings, Volume 26, Number 8

How to Cite

Moon, Y. H. and Youn, H. J. (2005) 3D Fem Simulation of Mlcc Thermal Shock, in Developments in Advanced Ceramics and Composites: Ceramic Engineering and Science Proceedings, Volume 26, Number 8 (eds M. E. Brito, P. Filip, C. Lewinsohn, A. Sayir, M. Opeka and W. M. Mullins), John Wiley & Sons, Inc., Hoboken, NJ, USA. doi: 10.1002/9780470291283.ch29

Author Information

  1. Samsung Electro-Mechanics Co. Ltd. 314 matan-dong Suwon-city, Kyung-gi-do, 443–743

Publication History

  1. Published Online: 26 MAR 2008
  2. Published Print: 1 JAN 2005

ISBN Information

Print ISBN: 9781574982619

Online ISBN: 9780470291283

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Keywords:

  • automobile;
  • parameter;
  • thermal;
  • temperature;
  • asymmetric

Summary

MLCC(multiplayer ceramic capacitors) for automotive applications need higher thermal cycle reliability than other general purpose MLCC because the automobile environment is more severe. In the paper, we use 3 dimensional FEM simulations try to reduce the stress in MLCC and prevent cracks in MLCC during thermal cycle reliability tests. We calculated the residual stress during production process of MLCC and during reflow soldering. Thermal cycle stress is simulated considering strain hardening and creep effect.

Stress in MLCC is calculated for various MLCC chip design parameter and surface mounting parameter on PCB(like dimension of MLCC, external electrode, and solder height etc) and the parameters were optimized to reduce the stress during thermal cycle including satisfying board flex reliability.