Chapter 13. Diffusion Bonding of Silicon Carbide Ceramics Using Titanium Interlayers

  1. Rajan Tandon,
  2. Andrew Wereszczak and
  3. Edgar Lara-Curzio
  1. Michael C. Halbig1,
  2. Mrityunjay Singh2,
  3. Tarah P. Shpargel3 and
  4. James D. Riser3

Published Online: 27 MAR 2008

DOI: 10.1002/9780470291313.ch13

Mechanical Properties and Performance of Engineering Ceramics II: Ceramic Engineering and Science Proceedings, Volume 27, Issue 2

Mechanical Properties and Performance of Engineering Ceramics II: Ceramic Engineering and Science Proceedings, Volume 27, Issue 2

How to Cite

Halbig, M. C., Singh, M., Shpargel, T. P. and Riser, J. D. (2008) Diffusion Bonding of Silicon Carbide Ceramics Using Titanium Interlayers, in Mechanical Properties and Performance of Engineering Ceramics II: Ceramic Engineering and Science Proceedings, Volume 27, Issue 2 (eds R. Tandon, A. Wereszczak and E. Lara-Curzio), John Wiley & Sons, Inc., Hoboken, NJ, USA. doi: 10.1002/9780470291313.ch13

Author Information

  1. 1

    U.S. Army Research Laboratory Vehicle Technology Directorate NASA Glenn Research Center Cleveland, Ohio 44135

  2. 2

    Ohio Aerospace Institute NASA Glenn Research Center Cleveland, Ohio 44135

  3. 3

    NASA Glenn Research Center Cleveland, Ohio 44135

Publication History

  1. Published Online: 27 MAR 2008
  2. Published Print: 1 JAN 2006

ISBN Information

Print ISBN: 9780470080528

Online ISBN: 9780470291313

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Keywords:

  • diffusion;
  • silicon;
  • chemical vapor composite (CVC);
  • physically vapor deposited (PVD);
  • microcracks

Summary

Robust joining approaches for silicon carbide ceramics are critically needed to fabricate leak free joints with high temperature mechanical capability. In this study, titanium foils and physical vapor deposited (PVD) titanium coatings were used to form diffusion bonds between SiC ceramics using hot pressing. Silicon carbide substrate materials used for bonding include sintered SiC and two types of CVD SiC. Microscopy results show the formation of well–adhered diffusion bonds. The bond strengths as determined from pull tests are on the order of several ksi. Electron microprobe results show the distribution of silicon, carbon, titanium, and other minor elements across the bonded interface. Compositions of several phases formed in the joint region were identified. Potential issues of material compatibility and optimal bond formation are also discussed.